MDW 3803P Polishing Machine for single sided polishing of sapphire quartz wafer (1600213295711)

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Product Overview

Description

Product Description

Item name

Specification

Grinding disc size

f380mmxf120mmx12

Maximum workpiece size

f180

Main motor power

0.75KW

Main power supply

Three-phase 380V/single-phase 220V

Polishing disk speed

0-80RPM

Machining roughness

Ra0.005

Main motor speed

0-90RPM

Timing Range

99minutes59seconds

Total working pressure

0.4—0.6mpa

Working Station

3 sets

Total equipment weight

150kg

Dimensions

850x1100x1250mm

 

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Scope of Application:

Widely used for single-sided polishing of sapphire, Crystal, quartz wafer and other materials.

Principle of high precision polishing unit:

The polished material is placed on the polishing disk, and the polishing disk rotates against the clock. The correction wheel drives the workpiece to rotate. The gravity pressure puts pressure on the workpiece, and the workpiece and the polishing disk are relatively operated to achieve the polishing purpose.

Features of high precision polishing machine:

1. The interval automatic spray device is adopted, and the spray interval time can be set freely. Its working principle is that the stirring starting polishing solution can automatically flow over dropping liquid tubes to polishing disk, and the flow rate can be adjusted according to requirements (see dropping liquid pump manual for specific adjustment).

 

2.The workpiece of this polishing machine can be pressurized by saddle weight, and the pressure can be adjusted. 

3. Series polisher adopts switch button control system, and polishing disk rotation speed and timing can be directly set on the control panel.

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FAQ 1600213295711
0.0096 s.