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Item name |
Specification |
Grinding disc size |
f380mmxf120mmx12 |
Maximum workpiece size |
f180 |
Main motor power |
0.75KW |
Main power supply |
Three-phase 380V/single-phase 220V |
Polishing disk speed |
0-80RPM |
Machining roughness |
Ra0.005 |
Main motor speed |
0-90RPM |
Timing Range |
99minutes59seconds |
Total working pressure |
0.4—0.6mpa |
Working Station |
3 sets |
Total equipment weight |
150kg |
Dimensions |
850x1100x1250mm |
Scope of Application:
Widely used for single-sided polishing of sapphire, Crystal, quartz wafer and other materials.
Principle of high precision polishing unit:
The polished material is placed on the polishing disk, and the polishing disk rotates against the clock. The correction wheel drives the workpiece to rotate. The gravity pressure puts pressure on the workpiece, and the workpiece and the polishing disk are relatively operated to achieve the polishing purpose.
Features of high precision polishing machine:
1. The interval automatic spray device is adopted, and the spray interval time can be set freely. Its working principle is that the stirring starting polishing solution can automatically flow over dropping liquid tubes to polishing disk, and the flow rate can be adjusted according to requirements (see dropping liquid pump manual for specific adjustment).
2.The workpiece of this polishing machine can be pressurized by saddle weight, and the pressure can be adjusted.
3. Series polisher adopts switch button control system, and polishing disk rotation speed and timing can be directly set on the control panel.