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Article | Description | Capability | |
Material | Laminate materials | FR4, High TG FR4, High Frequency, Alum, FPC... | |
Board Cutting | Number of layers | 1-48 | |
Min.thickness for inner layers (Cu thickness are excluded) | 0.003”(0.07mm) | ||
Board Thickness | Standard | (0.1-4mm±10%) | |
Min. | Single/Double:0.008±0.004” | ||
4layer:0.01±0.008” | |||
8layer:0.01±0.008” | |||
Bow and twist | no more than 7/1000 | ||
Copper Weight | Outer Cu weight | 0.5-4 0z | |
Inner Cu weight | 0.5-3 0z | ||
Drilling | Min size | 0.0078”(0.2mm) | |
Drill deviation | ±0.002″(0.05mm) | ||
PTH hole tolerance | ±0.002″(0.005mm) | ||
NPTH hole tolerance | ±0.002″(0.005mm) | ||
Solder Mask | Color | Green,white,black,red,blue… | |
Min solder mask clearanace | 0.003″(0.07mm) | ||
Thickness | (0.012*0.017mm) | ||
Silkscreen | Color | white,black,yellow,blue… | |
Min size | 0.006″(0.15mm) | ||
Max Size of Finish Board | 700*460mm | ||
Surface Finish | HASL,ENIG,immersion silver,immersion tin,OSP… | ||
PCB Outline | Square,circle,irregular(with jigs) | ||
Package | QFN,BGA,SSOP,PLCC,LGA |
layer | prototype | Mass Productions (above 30 m2) | ||
Quick time | Normal Time | |||
2 | 24 hours | 3-4 days | 8-10 days | |
4 | 48 hours | 5-6 days | 10-12 days | |
6 | 72 hours | 6-8 days | 12-14 days | |
8 | 96 hours | 8-10 days | 14-16 days | |
10 | 120 hours | 12-14 days | 16-18 days | |
... | ... | ... | ... |
Order Conditions | Standard Delivery Date | The fastest Delivery Date |
Prototype (<20 pcs) | 2 days | 8 hours |
Small volum (20-100 pcs) | 3 days | 12hours |
Medium volum (100-1000 pcs) | 6 days | 24 hours |
Mass productions (>1000 pcs) | Depends on BOM | Depends on BOM |