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Fabrication Capability | ||
Items | Capacity | |
1.Base Material | FR-4, High TG FR-4, FR2, Aluminum, Rogers, CEM-1, CEM-3, Taconic, ceramic , crockery, Metal-backed Laminate | |
2.Layers | 1-18layer | |
3.PCB Standard | IPC class 2 & IPC class 3 | |
4.Certificate | ROHS, IPC | |
5.Finised inner/outer copperthickness | 1-6OZ | |
6.Finished board thickness | 0.2-7.0mm | |
7.Min hole size | Mechanical hole: 0. 15mm Laser hole: 0. 1mm | |
8.Plugging vias capability | 0.2-0.8mm | |
9.Outline profile | Rout, V-cut, Bridge, Stamp hole | |
10.Surface treatment | HASL, HASL lead free, Immersion Gold, Immersion Tin, Immersion Silver, Hard Gold, OSP... | |
10.Min.Trace Width & Line Spacing | 0.075mm/0.1mm(3mil/4mil) | |
11.Min.Hole Diameter for CNC Driling | 0.1mm(4mil) | |
12.Min.Hole Diameter for punching | 0.9mm(35mil) | |
13.Biggest panel size | 610mm* 508mm | |
14.Hole Positon | +/-0.075mm(3mil) CNC Driling | |
15.Conductor Width(W) | 0.05mm(2mil)or; +/-20% of original artwork | |
16.Hole Diameter(H) | PTH L:+/-0.075mm(3mil); Non-PTH L:+/-0.05mm(2mil) | |
17.Outline Tolerance | 0.125mm(5mil) CNC Routing; +/-0.15mm(6mil) by Punching | |
18.Warp & Twist | 0.70% | |
19.Insulation Resistance | 10Kohm-20Mohm | |
20.Conductivity | <50ohm | |
21.Test Voltage | 10-300V | |
22.Panel Size | 110×100mm(min); 660×600mm(max) | |
24.Controlled Impedance | +/-5% | |
25.Service | One-stop Service, 24Hours Technical Services, PCB Design |