Industrial equipment control printing circuit board custom two-layer pcb board manufacturer
- Category: Heavy Copper PCB >>>
- Supplier: Ganzhou,Xiangdafeng,Technology,Co.,Ltd.
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Product Overview
Description
Complete industrial facilities
● High-quality engineering and technical personnel,
● 30,000 square meters production line.
● Self-built industrial park, so the manufacturing cost is more advantageous
● Professional and responsible quality management team
● The manufacturing process of keeping improving
● Enthusiastic and active service personnel
Company Introduction
Our products include single sided board, double-sided board and multi-layer circuit boards, which are widely used in automobiles,industrial control, LED lighting, computers, medical treatment, communication, aviation, instrumentation, Bluetooth headset modules, microelectronics, automation control and other scientific and technological fields.
And has established extensive business contacts with many electronic manufacturers in Hong Kong and Taiwan, mainland, UnitedStates, Japan and Southeast Asia, which has won deep praise from customers, in addition, Heng has considerable popularity in themarket and has become a long-term designated circuit board service provider for many large manufacturers.
With 30000 square meters of factory buildings and modern production lines, it can professionally produce two to twenty layers of high-quality circuit boards with a monthly output of 30,000 square meters.
【Plate type】： FR4 TG170
【plate thickness】：2.0mm
【Minimum aperture】：0.2mm
【Minimum line width and line spacing】：0.15mm
【Surface treatment】：ENIG
【Layers】：16
【Gold thick】：2U"
【Test standard】：IPC-3
【Impedance】：55Ω
【Special craft】：Blind hole
【BGA】：0.4mm
【Vertical and horizontal ratio】：10:1
【Test point】：15000
PLAN
No | Item | Process capability |
1 | Number of layer | 1-20 Layers(standard) |
2 | Surface finish | HASL,Gold plating,Immersion gold,Solder coating,OSP |
3 | Material | FR4,Aluminum |
4 | Finish board thickness | 0.2mm-3.2mm |
5 | Copper Thickness | 1/2oz ; 12oz |
6 | Solder Mask | Green,Black,White,Red,Blue,Yellow,Matte Black |
7 | Min.Trace Width & Line Spacing | 0.075mm/0.1mm |
8 | Min.Hole Diameter for CNC Driling | 0.1mm |
9 | Biggest panel size | 720mm*540mm |
10 | Hole Positon | ±0.075mm |
11 | Hole Diameter(H) | PTH L:±0.075mm;Non-PTH L:±0.05mm |
12 | Outline Tolerance | 0.10mm CNC Routing;±0.10mm by punching |
13 | Warp & Twist | 0.70% |
14 | Insulation Resistance | 10KΩ-20MΩ |
15 | Conductivity | < 50Ω |
16 | Test Voltage | 10-300V |
17 | Layer-layer misregistration | 4 layers:0.15mm;6 layers:0.2mm |
18 | Minspacing between hole edge to circuity pattern of an inner layer | 0.15mm |
19 | Minspacing between board ouline to circuitry pattern of an inner layer | 0.15mm |
20 | Board thickness tolerance | 4 layers:±0.13mm;6 layers:±0.15mm |
21 | Impedance control | ±10% |
22 | Different Impendance | ±10% |
Manufacturing process
Quality assurance
Strictly grasp the quality of raw materials, track the whole production process, and give you better protection of products.
Flying probe/test rack inspection
Apply KINGBOARD copper clad laminate
Better protect your products
The purpose of gold deposition process is to deposit nickel gold coating with stable color, good brightness, flat coating and good
solderability on the stool surface of circuit board. It can be divided into four stages:
pre-treatment, nickel precipitation, gold
precipitation and post-treatment.
precipitation and post-treatment.
Vertical hot air solder leveling process is difficult to blow the thin welding plate flat, which brings difficulty to SMT mounting:
In addition, the service life of the tin spraying plate is very short, and the gold plating plate just solves this problem.
Solder coating also known as hot air leveling. The function is to prevent oxidation of bare copper surface and maintain solder
performance.
performance.
The quality of solder coating directly affects the welding quality of customers during subsequent production.
It is used to protect the copper surface from oxidation or vulcanization in normal environment. However, in the subsequent weldinghigh temperature,
this protective film must be easily removed by scaling powder.
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