MY series thermal conductive silicon pad is high-performance, thermal conductive gap filling materials, mainly for the transmission interface between the electronic equipment and heat sink or product outer covering. Nice stickiness, flexibility, good compression performance and excellent heat conductivity are designed for series, which make the products can discharge gas from the electronic original and heat sink, to achieve fully conforming and obviously cooling effect.
MY Test Value
Blue, Gray, Pink, White
Continuous use Temp
Q: Are you manufacturer?
A: Yes, we are a manufacturer has 10 years of manufacturing experience.
Q: How can I get free sample?
A: Free sample are available, and you only to pay the freight of express.
Q: What is the MOQ?
A: We don't have MOQ, we can accept small order.
Q: How long is your delivery time?
A: Generally it is 3-4 days, if the goods are in stock, or it is 4-7days if the goods are not in stock, it is according to quantity.
Q: What is your payment terms?
A: We can accept T/T, Paypal, West Union, Ali Trade Assurance.