1.5w/m.k~17.8w/m.k 2mm thermal conductive sheet 3mm thermal pads for gpu mobile phone

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Price:RUB 15.34
Price in USD:Details

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Product Overview

Description

MY series thermal conductive silicon pad is high-performance, thermal conductive gap filling materials, mainly for the transmission interface between the electronic equipment and heat sink or product outer covering. Nice stickiness, flexibility, good compression performance and excellent heat conductivity are designed for series, which make the products can discharge gas from the electronic original and heat sink, to achieve fully conforming and obviously cooling effect.

Test Item
Test Method
Unit
MY Test Value
Color
Visual

Blue, Gray, Pink, White
Thickness
ASTM D374
mm
0.3~20.0
Specific Gravity
ASTM D792
g/cc
1.8±0.1
Hardness
ASTM D2240
Shore C
18±5~40±5
Tensile Strength
ASTM D412
kg/cm2
8

ASTM D412
Pa
5.88*10 9
Continuous use Temp
EN344
-40~+220
Volume Resistivity
ASTM D257
Ω-CM
1.0*1011
Voltage Endurance
ASTM D149
KV/mm
6
Flame Rating
UL-94

V-0
Thermal Conductivity
ASTM D5470
w/m-k
1.0~17.8
Thermal Pad(High thermal conductivity)
The soft thermal silica sheet is designed from an engineering perspective. How to match the irregular surfaces of the material, using high-performance insulating and heat-conducting materials to eliminate air gaps, thereby improving the overall thermal conversion capability and enabling the device to operate at lower temperatures. The thermal conductivity of the thermal silica sheet is regulatable and the thermal conductivity is also better.
Thermal Gap Pad(high quality)
Because air is a bad conductor of heat, it will seriously hinder the transfer of heat between the contact surfaces, and the addition of a thermal silica film between the heat source and the heat sink can push the air out of the contact surface.

17.8w/m.k Thermal conductive pad(Soft, insulating, self-adhesive)

Has a certain degree of flexibility, excellent insulation, compressibility, natural surface tackiness, but also plays a role in insulation, shock absorption, sealing, etc., can meet the design requirements of equipment miniaturization and ultra-thin, is highly process With its wide application range and wide range of thickness, it is an excellent thermal conductive filler material that is widely used in electronic and electrical products. The main features: insulation, thermal conduction, wear, flame retardant, fill gap, anti-compression, buffer, etc.
0.0103 s.