DeepMaterial Black liquid Heat curing Epoxy resin Encapsulant for COB encapsulants dam&fill
- Category: >>>
- Supplier: Huizhou Shengyang Industrial Co. Ltd.
Share on (10000013196232):
Product Overview
Description
Product Description
DeepMaterial Epoxy encapsulant Adhesives
DM-6216 is suitable for applications where excellent heat treatment properties are required. After curing the heat shock resistance can be up to 177°C. It is particularly suitable for the
encapsulation of transistors and similar semiconductors and canbe used for the encapsulation of watch integrated circuits,component encapsulants and the encapsulation of smart card IC
Related Products
Lead, epitaph and silicon wafers
Protection from environmental, mechanical damage and corrosion.
Lead bonding chip
Encapsulation, cofferdam, and gap filling
Flip chip
CCD/CMOS component and VCM motor assmbly
$15 - $ 20 Pieces
500 Pieces (MOQ)
$15 - $ 20 Pieces
500 Pieces (MOQ)
$15 - $ 20 Pieces
500 Pieces (MOQ)
Packaging & Shipping
Company Information
DeepMaterial (Shenzhen) Co., Ltd. is an innovative company specializing in adhesives for semiconductor, electronic applications and surface protection materials for chip packaging and testing. Based on the core technology of adhesives, DeepMaterial has developed adhesives for chip packaging and testing, circuit board-level adhesives, and adhesives for electronic products.
Based on adhesives, it has developed protective films, semiconductor fillers, and packaging materials for semiconductor wafer processing and chip packaging and testing. To provide electronic adhesives and thin-film electronic application materials products and solutions for communication terminal companies, consumer electronics companies, semiconductor packaging and testing companies, and communication equipment manufacturers,to solve the above-mentioned customers in process protection, product high-precision bonding, and electrical performance.
Our Advantages
We Recommend
New Arrivals
New products from manufacturers at wholesale prices
