We manufacture lead frames for various ICs and LSIs, various heat spreaders (heat sinks) and other semiconductor package parts. We can do etching of copper alloys, 42 alloys and other materials of various thicknesses from 0.05t to 0.76t. Heat spreaders can be coated by nickel, gold or resin on one side. Please consult us if you need to review the cost.
Product name
Semiconductor package components
Brand Name
UPT
Place of Origin
Japan
Company Profile
To serve society with first-rate high precision products, UPT is supporting global leading companies in electronics, semiconductor related and other industries.
■Smaller, finer, and thinner than anywhere else We offer etching processes at a thickness of 0.004 mm (among the thinnest in the world). ■Wide range of supported materials and hardness Make your selection based on the desired specifications, such as spring load or conductive qualities. ■High quality × low cost × short delivery time Prototypes delivered as fast as 3 days. Low-cost mass production with Japanese-built quality is also possible. ■Responsive support Wide-ranging consultation and support for customer needs from specialists in every field.