Non drip purpose structural stainless steel cryogenic epoxy adhesive /ME 5064
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- Supplier: PELNOX LTD.
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Product Overview
Description
Products Description
Non-drip, impact-resistant one-component epoxy adhesive /ME-5064
ME-5064 is a one-component thermosetting epoxy resin.
It is mainly used for adhesives.
It is particularly resistant to vibration, has high adhesive strength, and is excellent for fixing all kinds of parts.
Product Name | ME-5064 | ME-5064 | ME-5064 | ME-5064 | |||
Product Category | One Component Type Resin, Environmentally Friendly Resin | One Component Type Resin, Environmentally Friendly Resin | One Component Type Resin, Environmentally Friendly Resin | One Component Type Resin, Environmentally Friendly Resin | |||
Function | One Component, Long Potlife, Stress Release | One Component, Long Potlife, Stress Release | One Component, Long Potlife, Stress Release | One Component, Long Potlife, Stress Release | |||
As supplied | （Typical Value） | ||||||
Item | Condition | Unit | |||||
Appearance | visual | ー | White viscous liquid | ||||
Specific Gravity | 25℃ | ー | 1.40 | 1.40 | |||
Viscosity | 25℃ | mPa・s | 75,000 | 75,000 | |||
TI Value | 3.8 | 3.8 | |||||
Gel Time | 130℃ 10g | minute | 10 | 10 | |||
Standard Curing Condition 130℃ x 60 minutes
As cured | ||||||||
Item | Condition | Unit | Typical Value | |||||
Hardness | JIS K-7215 25℃ | Shore D | 89 | 89 | ||||
Glass Transition Temperature | TMA | ℃ | 110 | 110 | ||||
Coefficient of Thermal Expansion | below Tg | 10^-5/℃ | 52 | 52 | ||||
above Tg | 10^-5/℃ | 147 | 147 | |||||
Shear Adhesive Strength | JIS K 6850 25℃ (Cu-Cu) | MPa | 20 | 20 | ||||
Flexural Strength | JIS K 6911 25℃ thickness 5 mm | MPa | 127 | 127 | ||||
Flexural Modulus | JIS K 6911 25℃ thickness 5 mm | MPa | 4,500 | 4,500 | ||||
Volume Resistivity | JIS K 6911 25℃ | Ω-cm | 6.3 ｘ 10^15 | ６．３×１０１５ | ||||
JIS K 6911 boil for 2hrs | Ω-cm | 1.2 ｘ 10^15 | ||||||
Water Absorption | JIS K 6911 boil for 2hrs | wt％ | 1.0 | |||||
Storage Modulus | DMA 25℃ 1Hz 5℃/min | GPa | 3,300 | |||||
The above values are typical and not specification | ||||||||
This product may not be exported due to national or regional chemical regulations; please contact us for details.
This product is a one-component epoxy resin, no mixing required!
This product does not drip easily and excels at fixing and bonding targeted areas.
This product must be kept refrigerated.
1. thaw thoroughly at room temperature before use.
2. Curing takes about 1 hour at 130°C.
Packaged safely and securely in metal containers at 3 kg/can.
Customized packages and containers are also available.
Please contact us for details.
Please contact us for details.
1. Who are we?
We are a Japanese resin manufacturer established in 1970.
Our lineup includes not only epoxy-based (liquid and powder) but also urethane and silicone-based insulating materials, coating materials, conductive paste materials, etc. Over 900 types of products are adopted and used worldwide.
2. How do you guarantee quality?
We always conduct a final inspection before shipment.
3. What can I purchase from you?
Epoxy-based products (liquid and powder), urethane, silicone-based insulating materials, and conductive materials.
4. Why should you buy from us instead of from other suppliers?
With our many years of experience and extensive product lineup, we are able to provide products that meet the detailed requirements of our customers.
We also have solid technical and support capabilities, so please feel free to contact us.
Our dedicated professionals are ready to support you.
5. What kind of services do you provide?
We provide technical support for resin selection, manufacturing process support, etc.
We provide packaging forms and quantities according to customer requirements.
We can customize resins according to the physical properties required by the customer.
Company Profile
PELNOX, LTD.
We are a formulator of resin compounds and adhesives manufacturing company, offering more than 900 products to more than 1,000 companies around the world.We can assist the customers where needed, from the small quantity prototype stage, up to the development of resin products. That is a wide range of materials including epoxy liquids and powders, urethane, silicone, and conductive paste materials.
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