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PCBA Production Capability | ||||||||
PCB types can be assembled: | FR4 PCB, rigid PCB, flexible PCB, rigid-flex PCB, aluminum PCB; | |||||||
Manufacture Process including: | THD(Thru-hole)/DIP,SMT(Surface-Mount), SMT&THD mixed | |||||||
PCB board Size can be assembled: | Size < 680mm*500mm, smallest 0.25*0.25 | |||||||
SMT Component Supported: | 01005-150mm, 0201, 0402, 0603, Flip-chip, QFP, BGA, uBGA, POP | |||||||
Assembly Accuracy | ± 20 um | |||||||
Component Height/Thickness Limit: | 0-25mm | |||||||
Lead Pitch | >0.3mm | |||||||
BGA Ball Pitch | >0.4mm | |||||||
Solder Type | Water Soluble Solder Paste, Leaded and Lead-Free | |||||||
Surface Finish | plating au, plating silver, plating sn | |||||||
Testing | X-Ray Inspection, AOI testing, ICT, Flying Probe, Burn-in, Function Testing | |||||||












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