Polyamide fpc flexible pcb with OSP suface finish

Items

Capabilities

Layers

FPC:1 to 6 Layers,Rigid Flex:2 to 10 Layers

Regular Base Materials

Kapton,Polyimide(PI),Polyester(PET)

Base Copper Thickness

1/3 oz to 2oz

Regular Base Material Thickness

12.5um to 50um(FPC)

0.1mm to 3.2mm(Rigid)

Regular Coverlay Thickness

27um to 50um

Regular Adhesive Thickness

12um to 25um

Blind or Buried Vias

Yes

Impedance Control

Yes

Min.Line Width/Spacing

0.04mm/0.04mm

Surface Finishing

Electroplate Ni/Au(Flash gold/Soft gold/Hard gold),ENIG,Immersion

Tin; plated silver;immersion silver ; OSP ,HASL

Outline Fabrication

Die cut,laser cut,CNC routing,V-scoring

Hole to edge(Hard tool/Die Cut)

±0.1/±0.2mm

Edge to edge(Hard tool/Die Cut)

±0.05/±0.2mm

Circuit to edge(Hard tool/Die Cut)

±0.07/±0.2mm