Electrolytic Conductive Micron Copper Powder For Sale

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Product Overview

Description



















Cu based brazing filler metal
Cu based brazing filler metal are composed of copper as the base and elements that can lower the melting point and improve its overall performance, such as P, Ag, Zn,Sn, Mn, Ni, Co, Ti, Si, B, Fe, etc., mainly pure copper, copper phosphorus, copper tin, copper zinc, copper manganese and other series.
Cu based brazing filler metal are widely used in the brazing of copper and copper alloys, carbon steel and cast iron, stainless steel, high-temperature alloys, cemented carbide, etc., with good electrical conductivity, thermal conductivity, and better strength and corrosion resistance, etc.

Common grades:BCu-1,CuSn15.6P5.2Ni4.2,CuSnTi

Typical Grades


GB/AWS/ISO
Chemical composition
(wt%)
Range of melting temperature
(℃)
Minimum brazing temperature
(℃)
BCu100/BCu-1
Cu≥99.9
1083
1093-1149
CuSn10
Sn9-11/Cu BAL.
840-1000
1020-1090
CuSn19Ti10
Sn18-20/Ti9-11/Cu BAL.
850-880
880-930
BCuP-2/BCu92P
P7.0-8.1/Cu BAL.
710-770
720-843
CuSn3P7
P6-8/Sn2-4/Cu BAL.
630-670
710-810
BCuP-9/BCu86SnP
P6-7/Sn6-7/Cu BAL.
650-700
700-810
BCuP-8/BCu76AgP
Ag17.2-18/P6-6.7/Cu BAL.
643-666
670-686
BCu86SnPNi
P4.8-6.5/Sn7-8/Ni0.5-1.5/Cu BAL.
612-682
682-812
CuSn15.6PNi4.2
P5.2/Sn15.6/Ni4.2/Cu BAL.
585-605
605-800
Cu595/BCu84NiMn
Mn11-13/Ni2-4/Cu BAL.
970-990
1000-1050
CuMn38Ni10
Mn37-39/Ni9-11/Cu BAL.
900-950
950-1070
BCuMnCo
Mn9-11/Co2-4/Cu BAL.
980-1030
1050-1100
BCu54Zn
Cu53-55/Zn BAL.
885-888
910-955
Cu773/BCu48ZnNi
Cu46-50/Ni9-11/Zn BAL.
890-920
938-982
Cu55ZnNiMn
Cu54-56/Ni6-8/Mn4-6/Zn BAL.
910-933
940-1040




Nickel-based filler metal
Nickel-based filler metal are composed of nickel as the base with the addition of elements that can lower the melting point and increase its thermal strength, such as chromium, boron, silicon and phosphorus, etc. The main series are nickel-chromium-silicon boron, nickel-silicon boron, nickel-chromium-silicon,nickel-phosphorus, nickel-chromium-phosphorus, etc.
Nickel-based filler metal are widely used in the brazing of stainless steel, high-temperature alloys, iron-based alloys, Fe-Ni-based alloys, diamond, cemented carbide, C/C composites, etc. They have excellent resistance to high temperature, corrosion, excellent mechanical properties, etc.

Common grades:BNi-2(BNi82CrSiBFe),BNi-7(BNi76CrP)

Typical Grades


GB/AWS/ISO
Chemical composition
(wt%)
Range of melting temperature
(℃)
Minimum brazing temperature
(℃)
BNi73CrFeSiB(c)/BNi-1
Cr13-15/Si4-5/Fe4-5/B2.75- 3.5/C0.6-0.9/Ni BAL.
980-1060
1066-1204
BNi74CrFeSiB/BNi-1a
Cr13-15/Si4-5/Fe4-5/B2.75-3.5/C0.06/Ni BAL.
980-1070
1077-1204
BNi82CrSiBFe/BNi-2
Cr6-8/Si4-5/Fe2.5-3.5/B2.75-3.5/Ni BAL.
970-1000
1010-1177
BNi92SiB/BNi-3
Si2.75-3.5/B4.0-5.0/Ni BAL.
980-1040
1010-1177
BNi95SiB/BNi-4
Si3-4/B1.5-2.2/Fe≤1.5/Ni BAL.
980-1070
1010-1177
BNi71CrSi/BNi-5
Cr18.5-19.5/Si9.75-10.5/Ni BAL.
1080-1135
1149-1204
BNi-5x
Cr28.5-29.5/Si3.5-4.5/P5.5-6.5/Ni BAL.
965-1035
1050-1125
BNi89P/BNi-6
P10-12/Ni BAL.
875
927-1093
BNi76CrP/BNi-7
Cr13-15/P9.7-10.5/Ni BAL.
890
927-1093
BCo-1
Ni16-18/Cr18-20/Si7.5-8.5/ W3.5-4.5/B0.7-0.9/C0.35-0.45/Co BAL.
1121-1149
1149-1232




Silver filler metal
Silver filler metal is an alloy brazing material based on silver or silver-based solid solution. It has the characteristics of low melting point, good wettability and caulking performance, excellent strength, plasticity, electrical conductivity, corrosion resistance, etc. It can be used to braze almost all ferrous and non-ferrous metals except aluminum, magnesium and other low melting point metals, and has excellent wettability for diamond, graphite and carbon, cubic boron nitride ceramic materials, etc. after adding active elements, so it is widely used.
In order to improve the process performance or economy and environmental protection of brazing materials, such as lowering the melting point, improving wettability, reducing the silver content, etc., zinc, tin, nickel, cadmium, indium and titanium alloy elements are usually added to the brazing materials to form ternary or multi-alloys.

Common grades:BAg-36,BAg-8(BAg72Cu),Ag43.6CuInTi

Typical Grades


GB/AWS/ISO
Chemical composition
(wt%)
Range of melting temperature
(℃)
Minimum brazing temperature
(℃)
BAg100/BVAg-0
Ag≥99.95
961
961-1038
BAg72Cu/BAg-8
Ag71-73/Cu BAL.
779
779-899
BAg92Cu
Ag91-93/Cu BAL.
779-872
871-982
BAg45CuZnSn/BAg-36
Ag44-46/Cu26-28/Zn23-2 7/Sn2.5-3.5
646-677
677-813
BAg56CuZnSn/BAg-7
Ag55-57/Cu21-23/Zn15-1 9/Sn4.5-5.5
618-652
652-760
BAg25CuZnSn/BAg-37
Ag24-26/Cu39-41/Zn31-3 5/Sn1.5-2.5
688-779
779-885
BAg50ZnCuNi/BAg-24
Ag49-51/Cu19-21/Zn26-3 0/Ni1.5-2.5
660-707
707-843
Ag43.6CuInTi
Ag43.6-Cu29.1-In24.3-Ti 3
540-650
680-800
AgCuTi4.5
Ag68.7-70.7/Ti4-5/Cu BAL.
770-810
830-930
AgCuTi2
Ag68.7-70.7/Ti1.5-2.5/Cu BAL.
780-805
825-927
AgCuTi3.3
Ag68.7-70.7/Ti2.8-3.8/Cu BAL.
780-810
850-930




Al-base solder
Al-base solder are mainly used for brazing aluminum and aluminum alloys, based on aluminum-silicon eutectic and aluminum-copper-silicon eutectic, with the addition of copper, zinc, manganese, magnesium and other alloying elements to form binary or multi-alloy brazing consumables. It is suitable for flame, furnace and vacuum brazing methods. Except for vacuum brazing, all aluminum brazing needs to be applied with a suitable aluminum brazing flux, and the joint must be thoroughly cleaned of brazing flux residues after welding.

Common grades:BAl88Si,BAl86SiCu

Typical Grades


GB/AWS/ISO
Chemical composition
(wt%)
Range of melting temperature
(℃)
BAl92Si/Al 107
Si6.8-8.2/Fe≤0.8/Cu≤0.25/Mn≤0.10/Zn≤0.20/Al BAL.
575-615
BAl90Si/Al 110
Si9-11/Fe≤0.8/Cu≤0.30/Mn≤0.05/Mg≤0.05/Zn≤0.10/Al BAL.
575-590
BAl88Si/Al 112
Si11-13/Fe≤0.8/Cu≤0.30/Mn≤0.05/Mg≤0.10/Zn≤0.20/Al BAL.
575-585
BAl86SiCu/Al 210
Si9.3-10.7/Fe≤0.8/Cu3.3-4.7/Mn≤0.15/Mg≤0.10/Zn≤0.20/Al BAL.
520-585




Sn-based filler metal
The most widely used soft brazing material is Sn-Pb solder. When ωsn=61.9%, it forms eutectic with a melting point of 183°C. The working temperature of tin-lead brazing material does not exceed 100°C, and it has cold brittleness at low temperature.

Common grades:Sn63Pb37,Sn42Bi58,Sn96.5Ag3.5,Sn64Bi35Ag1

Lead alloys


Alloy Brand
Liquidus temperature
(℃)
Solidus temperature
(℃)
Sn43Pb43Bi14
163
144
Sn62Pb35.3Bi2.7
179
179
Sn62Pb36Ag2
179
179
Sn62.8Pb36.8Ag0.4
181
181
Sn63Pb37
183
183
Sn60Pb40
191
183
Sn75Pb25
192
183
Sn55Pb45
200
183
Sn50Pb50
216
183
Sn5Pb92.5Ag2.5
296
287
Sn10Pb90
302
275
Sn5Pb95
312
308



Lead-free solder alloy:


Alloy Brand
Liquidus temperature
(℃)
Solidus temperature
(℃)
Sn42Bi57.6Ag0.4
137
-
Sn42Bi58
138
138
Sn42Bi57Ag1
140
139
Sn59.9Bi40Cu0.1
170
150
Sn64Bi35Ag1
172
151
Sn64.7Bi35Ag0.3
172
151
Sn64.9Bi35Ag0.1
172
151
Sn69.5Bi30Cu0.5
185
149
Sn82.5Bi17Cu0.5
205
190
Sn96.5Ag3Cu0.5
219
217
Sn97.5Ag2Cu0.5
220
217
Sn98.5Ag1Cu0.5
222
217
SnCu0.7
227
227
Sn99Ag0.3Cu0.7
227
227
Sn98.8Ag0.5Cu0.7
227
227
Sn95.5Ag3.8Cu0.7
220
218
Sn96.5Ag3.5
221
221
Sn96Ag4
232
221
Sn100
232
232
Sn95Sb5
240
235
Sn90Sb10
245
240
Bi98Ag2
263
260
Bi100
271
271












0.0185 s.