Stable Quality LPi Photoimageable White Pism Solder Mask PCB

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Price:$10.00 - $14.00

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Product Overview

Description



Product Description




Specification




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Procedure
Content
(1)Dilution and viscosity adjustment
To stir for 5-10 minutes till it’s well proportioned. If the viscosity needs to be adjusted, 1-2% of the diluent can be added in.
It’s recommended to use BCS diluent.

(2)Standing
To stand 10-15 minutes after fully stirring, and then to process screen printing.

(3) Screen mesh
Either 36T or 43T is available

(4)Pre-curing
A:To print and cure each side separately:
The first side in hot air circulating oven: 75±5℃、15-20 minutes.
The second side in hot air circulating oven: 75±5℃、20-25 minutes.
B:To print and cure two sides at the same time.
Hot air circulating oven: 75±5℃、25-35 minutes.

(5)Exposure
7K UV contact exposure: 500-700mj/c㎡
21-step sensitivity guide: 9-12 steps covered.

(6)Developing
Developing solution: (1±0.2%) of Na2CO3 solution
Temperature of developing solution: 30±2℃
Developing time: 40-60 seconds
Washing pressure: 1.8~2.2kg/c㎡

(7)Posterior curing
Temperature: 150±5℃ Curing time: 60 minutes
Matters need attention:
1. To fully stir till it’s well-proportioned before using it.
2. Parameters above is only for reference, the specific operation should be subject to samples.



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