China Factory Price Automatic BGA Machine SMD BGA Rework Station Automatic GPU CPU IC Chips Removal Machine



Main Features:
For Laptop Computer Playstation Mobile Phone Motherboard Repair
• Repair Component Type:BGA/QFP/QFN/CSP/SOP,etc
• Component size: 1 ~ 80MM
• Temperature Precision: 2~3 ℃
• Machine Movement: Automatically Remove / Mount Component.
• CCD Optical Alignment System Placing Precision: 0.015MM
• Laser Positioning Function for fast positioning component and PCB.
• Highly Sensitive Mounting Pressure Control to protect PCB from damage.
• Repair Success Rate: 99%+
Specification:
•Power: AC 220V±10% 50/60 Hz
•Total Power: Max 5300W
•Heater Power: Top heater 1200W Bottom heater 1200W IR heater 2700 W
•Electrical materials:Intelligence Programmable Controller
•Temperature control: K-type thermocouple (Closed Loop),
independence temperature control, accuracy within2~3℃
•Positioning: Laser Positioning and V-groove, PCB support
•PCB size: Max 410×370 mm
•BGA chip: Max 80×80mm Min 1×1 mm
•Dimensions:L640×W630×H900 mm
•Weight:68kg
We also have the Cost-effective manual BGA Rework Station as below, it is also a good choice for the beginner of chip level repairing.
Complete Spare Parts for BGA Rework Station
BGA Reballing Accessory Also Available