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QianLi Spot Delivery Mobile Phone 3D Black IC Reballing Stencils for Android BGA IC Reball Kit Stencil Kit
QianLi Spot Delivery Mobile Phone 3D Black IC Reballing Stencils for Android BGA IC Reball Kit Stencil Kit
QianLi Spot Delivery Mobile Phone 3D Black IC Reballing Stencils for Android BGA IC Reball Kit Stencil Kit
QianLi Spot Delivery Mobile Phone 3D Black IC Reballing Stencils for Android BGA IC Reball Kit Stencil Kit
QianLi Spot Delivery Mobile Phone 3D Black IC Reballing Stencils for Android BGA IC Reball Kit Stencil Kit
QianLi Spot Delivery Mobile Phone 3D Black IC Reballing Stencils for Android BGA IC Reball Kit Stencil Kit
QianLi Spot Delivery Mobile Phone 3D Black IC Reballing Stencils for Android BGA IC Reball Kit Stencil Kit

QianLi Spot Delivery Mobile Phone 3D Black IC Reballing Stencils for Android BGA IC Reball Kit Stencil Kit

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Price:$4.12 - $4.20

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Product Overview

Description



Products Description






Product Name
3D Black Stencil
Applications
Stencil for reballing of Android components
Color
Black
Material
Steel
Packaging
Each stencil has its own plastic packaging.We ship multiple pieces in cartons.


3D Black Stencil For Andorid:


Version
Retail Price (USD)
MSM 8937 2AA
$4.12
MSM 8996
$5.44
MSM 8917 2AA
$3.38
MSM 8953 B01-AB
$4.12
MSM 8940 1AA
$4.12
MSM 8916 8909 8939
$4.12
MSM 8953 1AB
$4.12
MTK 6582
$3.38
SDM636 100-AA
$4.12
SDM660 301-AA
$4.12
Kirin 655/659
$5.44
EMMC General DDR
$2.65


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