Fully Automatic Die Bonder Machine Fully Automatic Die Bonder Equipment High Precision High Output for Camera Module

Product Overview

Description

Fully Automatic Die Bonder Machine,Fully Automatic Die Bonder Equipment High Precision High Output for Camera Module

Product Description:
The product is taken out from the magazine by a precise delivery track ,Wafer auto stripping and feeding and positioned precisely;The multi-axis high-precision manipulator is visually guided by the industrial camera to complete the precision dispensing and wafer loading process of the product.

 

Equipment application and industry:
Semiconductor production technique and CCM camera module dispensing and laminating technique, to meet the position accuracy requirements of upper and lower assembly and lamination.

1. High efficiency, overall UPH≥5000 pcs/H;
2. High yield,yield≥ 99% (In addition to product incoming factors);
3. High precision, XY position accuracy :±10 μm deflection Angle ±0.2°bond head pressure 100~1000g (programmable)


Technical Parameters:

Application	Fully automatic wafer loading
Weight	2010KG
Loading and unloading machine carrier platform size	320x 80mm
Auto Wafer size (LxW)	MAX:8inch
XY position accuracy	When the ambient temperature fluctuates within ±1°
XY Mounting accuracy	Depends on the stability of product accuracy
Bond head pressure control	50g~400g (Accurate pressure to ±10g)
UPH	5k~15k pcs/h (According to the product process and the number of products on the vehicle)
XY axis maximum speed	1500mm/s
Equipment cleanliness level	Grade 100
Power specifications	220 VAC (±5%) , 50-60 Hz
Total power	3KW

Our brand customers:

 

 

1000#Fully Automatic Die Bonder Machine,Fully Automatic Die Bonder Equipment High Precision High Output for Camera Module

2000#Fully Automatic Die Bonder Machine,Fully Automatic Die Bonder Equipment High Precision High Output for Camera Module

3000#Fully Automatic Die Bonder Machine,Fully Automatic Die Bonder Equipment High Precision High Output for Camera Module

4000#Fully Automatic Die Bonder Machine,Fully Automatic Die Bonder Equipment High Precision High Output for Camera Module

5000#Fully Automatic Die Bonder Machine,Fully Automatic Die Bonder Equipment High Precision High Output for Camera Module

6000#Fully Automatic Die Bonder Machine,Fully Automatic Die Bonder Equipment High Precision High Output for Camera Module

7000#Fully Automatic Die Bonder Machine,Fully Automatic Die Bonder Equipment High Precision High Output for Camera Module