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CAPABILITY | STANDARD | ADVANCED |
MinimumLayer Count | 1 | 1 |
Maximum Layer Count | 12 | 40 |
Material | FR-4 (Tg-135C, 145C, 170C), Halogen- free | |
Rogers Ultralam 2000, Rogers RO4350, Rogers RO4003 | ||
Polyimide | ||
Black FR-4 | ||
Arlon AR-350 | ||
CEM-3 | ||
Getek Copper Clad Thermal Substrates | ||
Hybrid (Rogers and FR4) BT Epoxy | ||
Nelco 4013 | ||
PTFE | ||
Metal Core Materials | ||
Aluminum Core | ||
Board Thickness | 0.020"-0.125" | 0.005"-0.250" |
Maximum Board Size | 16" x 22" | 10" x 16" |
12" x 21" | 16" x 22" | |
22" x 28" | 12" x 21" | |
22" x 28" | ||
Copper Thickness | 0.5 oz – 3 oz | 0.25 oz – 12 oz |
Minimum Trace Width / Spacing | 0.004"/0.004" | 0.003"/0.003" |
Solder Mask Color | Green, Blue, Black, Red, Yellow, White, Clear, and customized | |
Silkscreen Color | White, Black, Yellow, Green, Red, Blue and customized | |
Minimum Hole Size | 0.008" | 0.004" |
Finished Hole Size Tolerance | +/-0.003" | +/-0.002" |
PCB Surface Finish | HASL (vertical & Horizontal), Lead Free HASL, OSP/Entek, ENIG, ENEPIG, | |
HASL + Gold Finger,Immersion Tin(ISn), Immersion Silver(IAg), Carbon | ||
Ink, Hard Gold(Flash Gold), Soft Gold | ||
IPC Class | Class 2 | Class 3 |
Controlled Impedance Tolerance | +/-10 % | +/-5 % |
Blind Vias | Yes | Yes |
Buried Vias | Yes | Yes |
Aspect Ratio | 44044 | 43845 |
Minimum Core Thickness | 0.004" | 0.002" |
Carbon Ink | Yes | Yes |
Peelable Mask | Yes | Yes |
Solder Sample | Yes | Yes |
First Article | Yes | Yes |
ISO 9001: 2008 | Yes | Yes |
ISO/TS16949: 2009 | Yes | Yes |
UL 94v0 | Yes | Yes |
























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