IP Camera Module Wifi PCB CCTV Camera FPC PCB Board Electronic PCB PCBA Manufacturing (1600155059375)

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Price:$7.50 - $8.50
Price in USD:Details

Quantity:


Product Overview

Description



Product Description




Specification


Material
FR4, High TG FR4, Rogers 4350/4003,Arlon,Taconic,Nelco,TP,Polyimide
Type of Rigid PCB
Back Board, HDI, Blind Buried hole, Buried capacitor, Buried resistor, thick copper.
Max Thickness
394mil (10MM)
Max. Panel Size:
1150mmx560mm
Surface Finish
HASL, HASL Lead-Free, Immersion/Plate gold, Goldfinger, OSP, AS, Sn, ENIG+OSP, ENIG+G/F,
Line Width/Space
Inner Layer:1/2 OZ-10OZ; Out Layer:1/3 OZ-10OZ.
Solder Mask Color:
Green, Yellow, Black, Blue, Red, Pink, White, Purple, Matt Green
Silkscreen:
White, Yellow, Black
Board Thickness:
0.2-6.0MM
Number of Layers:
1-58Layers
Special Process
Buried Hole, Blind Hole, Embedded Resistance, Embedded Capacity, Hybrid, Partial hybrid, Partial high density, Back drilling and
Resistance control.


Packing & Delivery




To better ensure the safety of your goods, professional, environmentally friendly, convenient and efficient packaging services will be provided.


Company Profie








1) PCB manufacturing
Needed: Gerber file(main), .Pcb.Doc and KiCAD-PCB, etc.
2) Components sourcing
Needed: BOM list included detailed Part number and Designator.
3) PCB assembly
Needed:PCB file and BOM list.
Our sales & engineer teams will reply you completely PCBA Quotation within 12 hours.


FAQ


PCB Making
Layers: 1-58 layers
(Main advantages from 2 layers, 4layers 6 layers, 8 layers hdi to 20layers.)
Max.Thickness:
HASL lead free is 0.6-4.0mm; ENIG is 0.2-7.0mm; Siliver: 0.4-5.0mm;
Material: FR-4 TG170 TG180 in mass production
(Shengyi S1141,S1165,S1600, IT180A,etc.)
Min.Width/Spacing: 0.1mm in hdi, and 0.15-0.2mm for standard making.
Max.Copper Thickness: 0.5oz-12oz heavy copper
Min. Hole Size: Laser drill is 0.1mm-0.15mm | ±0.05mm (4-6mil±2mil)
Max. Panel Size: 1150mmx560mm
Aspect Ratio: 12:1 and 8:1 in mass production
Surface Finish: HASL lead free,Immersion Gold, Immersion Silver mainly.
Special Process:
Buried Hole, Blind Hole, Embedded Resistance, Embedded Capacity,
Hybrid, Partial hybrid, Partial high density, Back drilling and Impedance control.








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