Prima Power Genius Laser Cutting Machine 4020
$13,550.00-15,800.00
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Why Choose Laser Cutting? | ||
High-speed, High-precision control | ||
Compatible with multiple types of process control | ||
Core independent research and development | ||
Integrated customised applications | ||
Why Choose Us? | ||||||||
1 | MES system full closed-loop production control--Real-time observation of line body indicator | |||||||
2 | Technologically advanced--400mm station spacing, 0.8 seconds to complete, positioning accuracy up to μ level | |||||||
3 | Standardisation--Hundreds of automated line body experience, equipment has been standardised | |||||||
4 | Low costs--Quickly used for mass production of similar products and can be used in multiple applications | |||||||
5 | Increased output--Automatic offset compensation, laser coding and CCD reading in one device. | |||||||
6 | High efficiency--Dual-platform work scheduling system, power monitoring system | |||||||
7 | High compatibility--Compatible with different product sizes and thicknesses, self-developed software | |||||||
8 | High performance--Precise visual positioning, large field of view capture range | |||||||
9 | High precision--Graphic accuracy and alignment accuracy of ≤±10μm can be achieved | |||||||
10 | Intelligent--Full-automatic intelligent programme setting is simple, stable precision and high efficie | |||||||
Technical Parameter | ||
Product name | CCD Tracing-edge of Lsaer-Cutting | |
Motion platform | Linear motor moving gantry | |
Marking head type/Power | UV/15w(optional) | |
location determination | Tracing-edge of Lsaer-Cutting, Mark point grabbing | |
Recognition system | CCD positioning, Recognizable graphic positioning, With automatic positioning function | |
Cutting thickness | <1.5mm(power size affects cutting thickness) | |
Expansion and contraction compensation function | Automatic expansion and contraction compensation for the position of the mark point, uniform deformation file | |
Equipment size | L1770*W1350*H2050(mm) | |
Airborne dust | Equipped with dust suction and filtration device | |
Working temperature and humidity | Temperature 25 ± 5 ° C, humidity not condensing, ground vibration acceleration<0.01mm/(s<2) | |
MES function | Can interface with various customized mes communication needs of customers | |
Power/Air Pressure Demand | 220V 60Hz/ 0.4-0.6Mpa | |
Laser/fiber wavelength | 355nm | |
Platform positioning accuracy | ±0.003mm | |
Repeatability | ±0.002mm | |
Galvanometer scanning range | 50*50mm(optional) | |
Galvanometer system | SCANLAB-basiCube10(optional) | |
Cutting range | 350 mmX500mm(customizable) | |
Cutting efficiency | 1000mm/s(Cutting thickness affects cutting efficiency) | |
Cutting width | 25±5um | |
Comprehensive machining accuracy | ±30um | |
Working cooling cycle requirements | Water-cooling | |
Cutting material category | Cover Film(CVF), IC chip, Wafer scribing, Wafer scribing, Flexible circuit board, Rigid Flex(RF), Memory card, PCBA sub board, Flexible circuit board(FPC) | |
Power consumption of the entire machine | <3.5KW | |




Applications | ||||||||
Cover Film(CVF) | IC chip | Wafer scribing | Fingerprint recognition module | Flexible circuit board | ||||
Rigid Flex(RF) | Memory card | PCBA sub board | Flexible circuit board(FPC) | More | ||||





















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