China Supplier Colorless Epoxy Resin AB Glue Potting Glue For Electronic Components
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- Supplier: Dongguan Benu Composite Material Co. Ltd.
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Product Overview
Description
Product Description
Epoxy resin 1169AB-X-2 is a two-component epoxy resin, low viscosity, colorless and transparent, good natural deaeration, good flexibility when curing at room temperature or heating, and good surface.
Epoxy resin 1169AB-X-2 is mainly used for surface encapsulation of LED light strips and light strips, jewelry glue, crystal crafts, signs, nameplates, badges, or transparent perfusion of electronic components.
Technical parameter
Resin 1169A-X | Hardener 1169B-X-2 | ||
Color | Colorless&Clear | Colorless&Clear | |
Density (g/m3) | 1.07+0.05 | 0.95+0.03 | |
Viscosity (mPa·s) | 300+100 | 500+200 | |
Brookfield DV2TRV Test method | 25℃ | ||
Mixing ratio (by weight) | 1 ： 1 | ||
(By volume) | 0.89 ： 1 | ||
After mixing
Resin+Hardener | ||
Status | Fluid | |
Viscosity | 350±50mPa.S | |
Brookfield DV2TRV Test method | 25℃ | |
Operating time (100g, 25℃) | 50±5 min | |
Brookfield DV2TRV Test method, viscosity up to 840mPa•s | ||
Dosage | 280-350 g/m2(Depending on the base material) | |
Curing time
Initial curing | About 10-12 hrs at room temperature |
Final curing | 20 hrs at room temperature |
Operating temperature range | 10℃-70℃ |
Instructions
Working environment :Please keep the container clean. The parts A and B are proportioned strictly according to the weight ratio, accurately weighed, and fully stirred clockwise along the inner wall of the container, and then allowed to stand for 3-5 minutes before use.
Precautions: Adjust the amount of glue according to the operating time and amount to avoid waste. When the temperature is lower than 15℃, please preheat the A glue to 30 ℃ before adjusting the glue, easy to operate (A glue will thicken when the temperature is low); The lid must be sealed after use to avoid product scrap due to moisture absorption. When the relative humidity is greater than 85%, the surface of the cured product will easily absorb the moisture in the air and form a layer of white mist. Therefore, when the relative humidity is greater than 85%, it is not suitable for room temperature curing. It is recommended to use heated curing.
Test Results
Hardness | shoreD | 58 |
Bending strength | Kg/mm2 | 28 |
Heat distortion | ℃ | 50 |
Water absorption | % | <0.1 |
Compressive strength | Kg/mm2 | 8.4 |
Storage
Whether freezing | Yes | ||
Moisture sensitive | Resin | Hardener | |
No | Sensitive | ||
Recommended storage temperature | 15℃-25℃(Not lower than 10℃, not higher than 50℃) | ||
Valid period | 6 months from the original packaging | ||
Package | Resin | Hardener | |
5 kg/pot | 5 kg/pot | ||
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