High quality embossing table top automatic die creasing machine
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- Supplier: NSC ENGINEERING CO. LTD.
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Product Overview
Description
Products Description
Chemical dimple suppression machine for glass products
(730x920 Workpiece size)
To achieve process of slimming LCD glass substrates, there are 2 representative methods: “mechanical grinding” and “chemical etching”.In recent days, chemical etching has been the mainly adopted method for its superiority in processing each glass substrate with a short takt time.
Among several different methods to perform chemical etching, in order to handle those LCD glass substrates growing larger in size, NSC Engineering chooses to design & fabricate single substrate chemical etching machines on which the glass substrates are conveyed in a horizontal lying position.
How dimples grow on glass surface & NSC’s original dimple suppression process
Any flaws or indentation cracks on the surface of a glass workpiece will expand and become dimples after chemical etching.
NSC’s original dimple suppression process, “NP Process,” is capable of suppressing growth of these dimples.
NSC’s original dimple suppression process, “NP Process,” is capable of suppressing growth of these dimples.
Sometimes due to any of the below reasons mechanical polishing is required even after glass workpieces have reached the target thickness through chemical slimming process. These examples are sometimes also adopted as countermeasures to dimples.
【Examples of mechanical polishing as countermeasures to dimples】
1. Perform mechanical polishing on all workpieces whether or not there is any dimple defect
2. Perform mechanical polishing only on those workpieces with dimple defects (repair)
However, if mechanical polishing needs to be performed on all of the workpieces, in this situation the amount of processed workpiece is almost impossible to reach the required amount for mass production.
In addition, when mechanical polishing process is adopted as a means of repair, there may be a potential risk: If the ratio of dimple defects is high, production rate will be limited and such production rate may be too late to meet promised delivery time.
Considering the above-mentioned problems, NSC Engineering’s dimple suppression machine for glass products, “NP”, is the suitable machine which contributes to production efficiency among glass slimming lines.
【Examples of mechanical polishing as countermeasures to dimples】
1. Perform mechanical polishing on all workpieces whether or not there is any dimple defect
2. Perform mechanical polishing only on those workpieces with dimple defects (repair)
However, if mechanical polishing needs to be performed on all of the workpieces, in this situation the amount of processed workpiece is almost impossible to reach the required amount for mass production.
In addition, when mechanical polishing process is adopted as a means of repair, there may be a potential risk: If the ratio of dimple defects is high, production rate will be limited and such production rate may be too late to meet promised delivery time.
Considering the above-mentioned problems, NSC Engineering’s dimple suppression machine for glass products, “NP”, is the suitable machine which contributes to production efficiency among glass slimming lines.
Available product size | 730x920mm | ||||||
Production capacity | 40,000sheet/mth | ||||||
Company Profile
NSC ENGINEERING CO.,LTD.
Our predecessor, Shinwa Co., Ltd. was an device maker specializing in wet process chemical device established in 1978. In 2018, NSC Engineering was launched after receiving a business transfer from Shinwa.NSC Group is a specialist of metal and glass surface treatment that uses chemicals. In addition to 40 years of know-how in the design and manufacture of wet process devices, we have unique surface treatment technologies using inorganic, organic chemical and electrochemical.
Our main products are Photoresist coating/ developing/ etching/ stripping/ washing machines, and electropolishing machines.
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