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Model No. | SF-3400 |
Solid content(wt%) | 80±2 |
Ag content(wt%) | 79±2 |
Width(µm) | FOG@4th:≤10 FOG@50%:≤2.5 |
Viscosity(25℃, mpa.s) | 6000~10000(10rmp) 3000~5500(60rmp) |
Curing process | 150℃/5~10min |
Firing process | 800~850℃/15min (Advice: 830℃/15min) |
Electrical conductivity(×106 S/m) | ≥40 |
Binding force(kgf/mm2) | ≥3.0 |
Solderability | 300℃/3s , Tin Coated area≥90% |
Solder resistance | 300℃*10s, 5 times |
Cleaner | Ethanol, ethyl acetate, butyl acetate |
Thinner | According to the requirements of dipping process |


Continent | Sample delivery time |
Asia | 1-4 days |
Euroup | 4-7 days |
North American | 4-7 days |
South American | 6-8 days |
Africa | 8-10 days |



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