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Grades | Characters | Applications | Advantages |
W5 fine grain size | 1.Average grain size:5μm 2.High diamond content over90% 3.Laser cutting or wire EDM cutting | Aluminum,Brass/Copper,Precious metals,Wood composites,Plastic | Excellent surface finish |
W10 medium grain size | 1.Average grain size:10μm 2.High diamond content over90% 3.Laser cutting or wire EDM cutting | Excellent resistance,good surface finish | |
W25 coarse grain size | 1.Average grain size:25μm 2.High diamond contentover90% 3.Laser cutting or wire EDM cutting | >14% Si/Al alloys,metal matrix composites,Bi-metals(aluminum/castiron),sintered ceramics and carbides | Long life,extremely high wear resistance |
Grade | Average diamond grain size (μm) | Diameter (mm) | Standard overall thickness (mm) | Average PCD thickness (mm) | PCD surface |
GC001 | 1 | 58 | 1.6, 2.0, 3.2 | 0.5 | Polished or unpolished |
GC002 | 2 | 58 | 1.6, 2.0, 3.2 | 0.5 | Polished or unpolished |
GC005 | 5 | 58 | 1.6, 2.0, 3.2 | 0.5 | Polished or unpolished |
GC010 | 10 | 58 | 1.6, 2.0, 3.2 | 0.5 | Polished or unpolished |
UA010 | 10 | 58 | 1.6, 2.0, 3.2 | 0.5 | Polished or unpolished |
GD025 | 25 | 58 | 1.6, 2.0, 3.2 | 0.5 | Polished or unpolished |
GA025 | 25 | 58 | 1.6, 2.0, 3.2 | 0.5 | Polished or unpolished |
GM253 | 25+3 | 58 | 1.6, 2.0, 3.2 | 0.5 | Polished or unpolished |
GM302 | 30+2 | 58 | 1.6, 2.0, 3.2 | 0.5 | Polished or unpolished |




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