SD-560 BGA Rework Station
1)Self-developed upper and lower heating air volume adjustment function, large chip or small chip, large air volume or small air volume, to ensure the welding effect!
Unique infrared fixed point function, more convenient and quick positioning BGA chip.
2)Adopt independently developed man-machine interface, the function can be seen, simple operation interface can be seen clearly at a glance.
3)Unique one-key curve generation function, more convenient, easier to operate.
4)Adopt each temperature zone separate heating function. The upper and lower heaters and the bottom heaters display three real-time temperature curves in the screen over time. The temperature is accurately controlled within ±0.1 degrees (the actual control is within ±3 degrees, the accuracy is affected by the environment). The upper and lower heaters can be controlled in up to 9 stages.
5) The hot air nozzle can rotate 360°; The bottom infrared heating plate can make the PCB board heat evenly.
|Upper Heating Power||1200W|
|Lower Heating Power||1200W|
|IR Warm-up Power||2700W|
|Fixed Type||PCB holder can be adjustable by X and Yaxes|
|PCB Size||Max450*500mm Min20*20mm|
|Temperature Control||K-type thermocouple closed loop control, indep endent temperature control, accurated achieve ±0.1°|