Original new Compute Module 3 /16GB (CM3 /16GB) With 16GB EMMC Flash CM3 supports more OS, like Windows 10
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- Supplier: Huizhou Oleading Technology Co. Limited
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Product Overview
Description
Product Description
In A Flexible Form Factory 16GB EMMC Flash Compute Module 3+8GB/16GB/32GB Raspberry Pi 3 Model B+ Raspberry Pi CM3 Model B
The CM3+/8GB Compute Module contains the guts of a Raspberry Pi 3 Model B+ (the BCM2837 processor and 1GB RAM) as well as an 8GB eMMC Flash device (which is the equivalent of the SD card in the Pi).
This is all integrated onto a small (67.6mm × 31mm) board that fits into a standard DDR2 SODIMM connector. The Flash memory is connected directly to the processor on the board, but the remaining processor interfaces are available to the user via the connector pins. You get the full flexibility of the BCM2837 SoC (which means that many more GPIOs and interfaces are available than with a standard Raspberry Pi), and designing the Module into a custom system should be relatively straightforward because the Pi Foundation has put all the tricky bits onto the Module itself.
CM3+ Features
* Broadcom BCM2837B0 * Cortex-A53 (ARMv8) 64-bit SoC @ 1.2GHz
* 1GB RAM
* eMMC Flash * CM3+/Lite: None, but brings the SD card interface to the Module pins so a user can wire this up to an eMMC or SD card
* CM3+/8GB: 8GB
* CM3+/16GB: 16GB
* CM3+/32GB: 32GB
* 200PIN SODIMM connector (35U hard gold plating I/O pins) * 48 x GPIO
* 2 x I2C
* 2 x SPI
* 2 x UART
* 2 x SD/SDIO (1x SD has been used for eMMC Flash on non-Lite variants)
* 1 x HDMI 1.3a
* 1 x USB2 HOST/OTG
* 1 x DPI (parallel RGB display)
* 1 x NAND(SMI)
* 1 x 4-lane CSI Camera Interface (up to 1Gbps per lane)
* 1 x 2-lane CSI Camera Interface (up to 1Gbps per lane)
* 1 x 4-lane DSI Display Interface (up to 1Gbps per lane)
* 1 x 2-lane DSI Display Interface (up to 1Gbps per lane)
* Compared to CM1, the CM3+ supports more OS, like Windows 10 (the free IOT-specific version from Microsoft)
Overview
The CM3+/8GB Compute Module contains the guts of a Raspberry Pi 3 Model B+ (the BCM2837 processor and 1GB RAM) as well as an 8GB eMMC Flash device (which is the equivalent of the SD card in the Pi).
This is all integrated onto a small (67.6mm × 31mm) board that fits into a standard DDR2 SODIMM connector. The Flash memory is connected directly to the processor on the board, but the remaining processor interfaces are available to the user via the connector pins. You get the full flexibility of the BCM2837 SoC (which means that many more GPIOs and interfaces are available than with a standard Raspberry Pi), and designing the Module into a custom system should be relatively straightforward because the Pi Foundation has put all the tricky bits onto the Module itself.
CM3+ Features
* Broadcom BCM2837B0 * Cortex-A53 (ARMv8) 64-bit SoC @ 1.2GHz
* 1GB RAM
* eMMC Flash * CM3+/Lite: None, but brings the SD card interface to the Module pins so a user can wire this up to an eMMC or SD card
* CM3+/8GB: 8GB
* CM3+/16GB: 16GB
* CM3+/32GB: 32GB
* 200PIN SODIMM connector (35U hard gold plating I/O pins) * 48 x GPIO
* 2 x I2C
* 2 x SPI
* 2 x UART
* 2 x SD/SDIO (1x SD has been used for eMMC Flash on non-Lite variants)
* 1 x HDMI 1.3a
* 1 x USB2 HOST/OTG
* 1 x DPI (parallel RGB display)
* 1 x NAND(SMI)
* 1 x 4-lane CSI Camera Interface (up to 1Gbps per lane)
* 1 x 2-lane CSI Camera Interface (up to 1Gbps per lane)
* 1 x 4-lane DSI Display Interface (up to 1Gbps per lane)
* 1 x 2-lane DSI Display Interface (up to 1Gbps per lane)
* Compared to CM1, the CM3+ supports more OS, like Windows 10 (the free IOT-specific version from Microsoft)
Production line
Certifications
Process Capability
PCB Production Capabilities | ||
Layer Count | 1Layer-32Layer | |
Finished copper thickness | 1/3oz-12oz | |
Min Line width/spacing internal | 3.0mil/3.0mil | |
Min Line width/spacing external | 4.0mil/4.0mil | |
Max Aspect Ratio | 10:1 | |
Board thickness | 0.2mm-5.0mm | |
Max Panel size(inches) | 635*1500mm | |
Minimum Drilled Hole Size | 4mil | |
PIated Hole Tolerance | +/-3mil | |
BIind/Buried Vias (AII Types) | YES | |
Via Fill(Conductive,Non-Conductive) | YES | |
Base Material | FR-4,FR-4high Tg.Halogen free material,Rogers,Aluminium base,Polyimide,Heavy Copper | |
Surface finishes | HASL,OSP,ENIG,HAL-LF,lmmersion silver,lmmersion Tin,Gold fingers,Carbon ink | |
SMT Production Capabilities | ||
PCB Material | FR-4,CEM-1,CEM-3,Aluminum-based board,FPC | |
Max PCB size | 510x1500mm | |
Min PCB size | 50x50mm | |
PCB Thickness | 0.5mm-4.5mm | |
Board thickness | 0.5-4mm | |
Min Components size | 0201 | |
Standard chip size component | 0603 and larger | |
Component max height | 15mm | |
Min lead pitch | 0.3mm | |
Min BGA ball pitch | 0.4mm | |
Placement precision | +/-0.03mm | |
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