Strong tin climbing, rounded, full and bright solder joints.Suitable for close-footed IC, PCB welding with a variety of high-demand materials.
Strong tin climbing, good electrical conductivity, and the solder joints are round, full and bright.Suitable for mobile phone repair BGA plant tin etc.
Suitable for paper boards or soft boards that cannot withstand high temperatures, Special welding of small components.Tin can't connect
The tin is full and bright, easy to use.Suitable for high temperature resistant double-sided glass fiber PCB
The upper tin is full, there are few residues, and it is non-corrosive. Suitable for lead-free products that have special
requirements for reflow soldering temperature.
Place of Origin