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QIANLI ip 02 BGA Metal Reballing Stencil Platform for iPhone 11/11PRO/11PRO MAX Middle Frame Motherboard Soldering
QIANLI ip-02 BGA Metal Reballing Stencil Platform for iPhone 11/11PRO/11PRO MAX Middle Frame Motherboard Soldering
QIANLI ip-02 BGA Metal Reballing Stencil Platform for iPhone 11/11PRO/11PRO MAX Middle Frame Motherboard Soldering
QIANLI ip-02 BGA Metal Reballing Stencil Platform for iPhone 11/11PRO/11PRO MAX Middle Frame Motherboard Soldering
QIANLI ip-02 BGA Metal Reballing Stencil Platform for iPhone 11/11PRO/11PRO MAX Middle Frame Motherboard Soldering
QIANLI ip-02 BGA Metal Reballing Stencil Platform for iPhone 11/11PRO/11PRO MAX Middle Frame Motherboard Soldering
QIANLI ip-02 BGA Metal Reballing Stencil Platform for iPhone 11/11PRO/11PRO MAX Middle Frame Motherboard Soldering

QIANLI ip 02 BGA Metal Reballing Stencil Platform for iPhone 11/11PRO/11PRO MAX Middle Frame Motherboard Soldering

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Price:RUB 2,065.78 - RUB 2,295.31

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Product Overview

Description

Product Name
QIANLI ip-02 BGA Metal Reballing Stencil Platform for iPhone 11/11PRO/11PRO MAX Middle Frame Motherboard Soldering
Brand name 
QIANLI
Model
ip-02
Color
Grey
Description:
QianLi Middle Frame Reballing Platform for iphone 11/11PRO/11PRO MAX motherboard soldering tool, QianLi Middle Frame Reballing Platform for iPhone 11/11PRO/11PRO MAX logic board dissembling and assembling testing tool.
QianLi Middle Frame Reballing Platform for iphone 11/11PRO/11PRO MAX separating .

Feature:
Stencils won't deform under high temperature
Featured material
Strong Magnetic attraction
Precise positioning
Efficiency Improvement
Unique design
Durable
Seiko
Main Products
Company Profile
Certificate
Packing and Delievery
FAQ

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