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No | Item | Data | |
1 | Quality Grade | Standard IPC2 | |
2 | Material | FR-4, FR4, High TG, Alumimum | |
3 | Layers | 1-50 layers | |
4 | Board Thickness(mm) | 0.2mm -7mm | |
5 | Board Size | Min 6*6mm | Max 500*500mm | |
6 | Copper Weight | 0.5 oz - 6.0 oz | |
7 | Inner Layer copper weight | 0.5 oz - 2.0 oz | |
8 | Min.Drilled hole size | 0.25mm | |
9 | Min.Line width | 0.075mm (3mil) | |
10 | Min.Line spacing | 0.075mm (3mil) | |
11 | Surface treatment | HASL lead free, ENIG | |
12 | Solder mask color | Green/Black/White/Red/Blue/Yellow | |
13 | Silkscreen Color | White, Blue, Black, Red, Yellow | |
14 | PCB Testing | E-test or flying probe test | |
15 | Impedance Tolerance | ±5% - ±10% | |
16 | SMD Pitch | 0.2mm (8mil) | |
17 | BGA Pitch | 0.2mm (8mil) | |
18 | Chamfer of Gold Fingers | 20, 30, 45, 60 | |
19 | Solder Mask Bridge | 0.1mm |






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