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Available Metallization&Plating Specifications | ||
Available Ceramic Compositions | Al2O3 94%,97%,99.5% | |
Available Metallization Materials | Mo/Mn | |
Metallization Thickness | 25±10um | |
Available Plating Materials | Ni/Ag/Au | |
Plating Thickness | 2-10um |
Metallization Processing (See Process Description Below) | Outer Diameter and Inner Diameter Banding |
Brush | |
Screen Printing | |
Spray | |
Needle | |
Base Metallization Materials | Moly Manganese |
Tungsten Manganese | |
Moly Tungsten Manganese | |
Materials for Metallization | Aluminum Oxide |
Beryllium Oxide (Restrictions Apply) | |
Metallization Characteristics/Benefits | Low Temperature Firing |
Universally Applicable | |
Process Speed | |
Uniform Coating, Thickness and Density | |
No substrate deformation | |
Intended Applications for Metallization Products | Traveling Wave Tubes |
Vacuum Electronic Devices | |
Medical Devices | |
Photon Machines | |
Neutron Generators | |
X-Ray Tubes | |
Klystrons | |
High Vacuum Feed Through | |
Relay Insulators | |
E-Beam Technology |