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STHL offer PCB Assembly service for prototypes, trial and mass orders. Our market covers a lot of fields like communication, aviation, energy & power, safety & security, medical device, LED lighting, consumer electronics, industrial, automotive electronics,smart home appliance, etc.



Items | PCBA capacity |
Product name | mobile app controlled elevator drone flight controller board pcb |
Assembly details | SMT and Thru-hole, ISO SMT and DIP lines |
Testing on products | Testing jig/mold , X-ray Inspection, AOI Test, Functional test |
Quantity | Min quantity : 1pcs. Prototype, small order, mass order, all OK |
Files needed | PCB : Gerber files(CAM, PCB, PCBDOC) |
| Components : Bill of Materials(BOM list) |
| Assembly : Pick-N-Place file |
PCB Panel Size | Min size : 0.25*0.25 inches(6*6mm) |
| Max size : 1200*600mm |
Components details | Passive Down to 0201 size |
| BGA and VFBGA |
| Leadless Chip Carriers/CSP |
| Double-sided SMT Assembly |
| Fine BGA Pitch to 0.2mm(8mil) |
| BGA Repair and Reball |
| Part Removal and Replacement |
Component package | Cut Tape, Tube, Reels, Loose Parts |
PCB+ assembly process | Drilling-----Exposure-----Plating-----Etaching & Stripping-----Punching----- Electrical Testing-----SMT-----Wave Soldering-----Assembling-----ICT-----Function Testing-----Temperature & Humidity |
PSMT PCB Assembly Capabilities
– Ball Grid Array (BGA)
– Ultra-Fine Ball Grid Array (uBGA)
– Quad Flat Pack No-Lead (QFN)
– Quad Flat Package (QFP)
– Small Outline Integrated Circuit (SOIC)
– Plastic Leaded Chip Carrier (PLCC)
– Package-On-Package (PoP)
– Small Chip Packages (pitch of 0.2 mm)
– AOI inspection
– X-Ray Inspection
PCB Assembly Capabilities
Armed with advanced equipment and supported by a sophisticated technical team, STHL Technology provides extremely reliable turnkey PCBA manufacturing services cover the following: PCB layout & design, material sourcing, IC programming, SMT assembly, THT assembly, mixed technical assembly, ICT test, function testing, conformal coating, cable assembly and labeling, as well as complete box build service.
Type of Assembly | SMT and DIP assembly |
Foot Pin | SO, SOP, SOJ, TSOP, TSSOP, QFP, BGA and U-BGA |
Solder Type | Water Soluble Solder, Lead-Free, Wave soldering |
Components | Passive Down to 0201 size |
| BGA and VFBGA |
| Leadless Chip Carriers/CSP/QFN |
| Double-sided SMT Assembly |
| Fine Pitch to 0.8mils |
| BGA Repair and Reball |
| Part Removal and Replacement |
PCB assembly process | Components purchasing |
| IQC materials inspection |
| Components and solder paste stock |
| SMT assemly ---AOI inspection 100%---X-ray inspection for BGA |
| Boards moving by transporting cart to avoid damage or polluting |
| DIP assembly ----Function testing if needed |
| Reliability Testing (burn-testing) - Package - Shipping |
Package | Anti-static Bubble Bag & Carton |

PCONTRACT
GET QUOTATION NOW, PLS CONTACT:
Melody Wang
Email:Sales01@firstpcba.com
MOBILE/WHATSAPP/WECHAT: 0086 13632851496
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