Widely used in insulating pouring of electronic components. The sintering temperature of electronic substrates (electronic ceramics) can be reduced by adding ultra-fine and ultra-pure quartz powder, and it can toughen, compact and enhance the strength of two-phase and multi-phase. It is the basic material for packaging adhesive products in the electronics industry. The electronic packaging materials used for LED, SMD, EMC electronic separation devices and electrical products are mainly waterproof, dust proof, harmful gas proof,vibration mitigation, external force damage prevention and circuit stability.