Aluminum PCB/PCBA LED custom Circuit Board manufacturer in CHINA
US $0.10-$10.00
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PCB Capability | ||||||||
Number of Layer | 1 - 20 Layer | |||||||
Maximum Processing Area | 680 × 1000MM | |||||||
Min Board Thickness | 2 Layer - 0.3MM ( 12 mil ) | |||||||
4 Layer - 0.4MM ( 16 mil ) | ||||||||
6 Layer - 0.8MM ( 32 mil ) | ||||||||
8 Layer - 1.0MM ( 40 mil) | ||||||||
10 Layer - 1.1MM ( 44 mil ) | ||||||||
12 Layer - 1.3MM ( 52 mil ) | ||||||||
14 Layer - 1.5MM ( 59 mil ) | ||||||||
16 Layer - 1.6MM ( 63 mil ) | ||||||||
18 Layer - 1.8MM ( 71 mil ) | ||||||||
Finished Board Thickness Tolerance | Thickness ≤ 1.0MM, Tolerance: ± 0.1MM | |||||||
1.0MM ≤ Thickness ≤ 6.5MM, Tolerance ± 10% | ||||||||
Twisting and Bending | ≤ 0.75%, Min: 0.5% | |||||||
Range of TG | 130 - 215 ℃ | |||||||
Impedance Tolerance | ± 10%, Min: ± 5% | |||||||
Hi-Pot Test | Max: 4000V/10MA/60S | |||||||
Surface Treatment | HASL, With Lead, HASL Free Lead | |||||||
Flash Gold, Immersion Gold | ||||||||
Immersion Silver, Immersion Tin | ||||||||
Gold Finger, OSP |
PCB Assembly Capability | PCB Assembly Capability | |||||||
Order Quantity | 1pc – 10,000,000+pcs | |||||||
Build Time | 1 – 5 days, 1 – 2 weeks, or scheduled deliveries | |||||||
PCB Spec Requirements | PCB whose width/length is less than 30mm should be panelized Max board size: 500×450 mm Board Type: Rigid PCBs, Flexible PCBs, Metal core PCBs Surface finish: lead/lead-free HASL, ENIG, Silver, OSP | |||||||
Assembly Types | Surface mount Thro-hole Mixed technology (SMT & Thru-hole) Single or double sided placement Conformal coating Shield cover assembly for EMI emission control | |||||||
Solder Type | Lead-free – RoHS | |||||||
Parts Procurement | Full Turnkey Partial Turnkey Kitted/Consigned | |||||||
Component types | SMT 01005 or larger BGA 0.4mm pitch, POP (Package on Package) WLCSP 0.35mm pitch Hard metric connectors Cable & wire | |||||||
SMT Parts Presentation | Bulk Cut tape Partial reel Reel Tube Tray | |||||||
Stencils | Laser-cut stainless steel | |||||||
Other Techniques | Free DFM Review Box Build Assembly 100% AOI test and X-ray test for BGA IC programming Components cost-down Function test as custom Protection technology |