DBC Copper Clad Ceramic

Product Overview

Description

The core technology of the aluminum nitride copper-clad ceramic substrate used in high-power semiconductor controlled water cooling system (semiconductor comtrolled water cooling system) is to weld a substrate material with good thermal conductivity and insulation under the semiconductor refrigeration chip-DBC (Direct Copper Bonding) Base substrate. The 0.3 mm thick copper layer on the DBC can etch small rectangular patterns required for circuit connections between semiconductors. There is a copper layer with a thickness of 0.1 under the DBC which is welded to the heat dissipation base of the water-cooled condenser for heat dissipation. Through the DBC, the upper semiconductor refrigeration circuit is insulated from the base shell, and the large amount of heat dissipated by the water cooling system is removed to the radiator outside the refrigeration system through the high-efficiency heat-conducting aluminum nitride DBC. Through semiconductor and DBC refrigeration, the structure problem of heat pipe heat dissipation and the problem of low refrigeration efficiency in the traditional refrigeration system are improved.