3X OEM Heat dissipation aluminium nitride substrate plate
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- Supplier: Sandingsheng Technology( Shenzhen) Company Limited
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Product Overview
Description
Product Description
| Products name | Aluminium nitride substrate plate |
| Meterial | Alumina nitride |
| Shape | Substrate |
| Color | beige |
| Density | 3.2g/cm3 |
| Max temperature usage | 1300℃ |
| Moulding method | Isostatic compaction |
| Compresive strength | 3800Mpa |
| Electrical insolation | Yes |
| Acid and alkali resistant | Yes |
| Thermal conductivity | 30W/mk |
| Applications | Industrial substrate |
Product Features 1.Uniform microstructure 2.High thermal conductivity* (70-180 Wm-1K-1), tailored via processing conditions and additives 3.High electrical resistivity 4.Thermal expansion coefficient close to that of Silicon 5.Resistance to corrosion and erosion 6.Excellent thermal shock resistance 7.Chemically stable up to 980°C in H2 and CO2 atmospheres, and in air up to 1380°C (surface oxidation occurs around 780°C; the surface layer protects the bulk up to 1380°C). |  |
 | PRODUCT PERFORMANCE - High thermal conductivity, high flexural strength, high temperature - Good electrical insulation - Low dielectric constant and loss - Able to be laser drilled, metallized, plated and brazed |
The aluminum nitride (ALN) ceramic has high thermal conductivity(5-10 times as the alumina ceramic), low dielectric constant and dissipation factor, good insulation and excellent mechanical properties, non-toxic, high thermal resistance, chemical resistance ,and the linear expansion coefficient is similar with Si,which is widely used in communication components, high power led, power electronic devices and other fields.Special spec products can be produced upon requests. |  |
Aluminium nitride substrate plate
Aluminum Nitride is an ideal material for use in thermal management and electrical applications. Additionally, Aluminum Nitride is also a common alternative to Beryllium Oxide (BeO) in the semiconductor industry as it is not a health hazard when machined. Aluminum Nitride has a coefficient of thermal expansion and electrical insulation properties that closely matches that of Silicon wafer material, making it an useful material for electronics applications where high temperatures and heat dissipation is often a problem.
Application
-Heat sinks & heat spreaders
-Chucks, clamp rings for semiconductor processing equipment
-Electrical insulators
-Silicon wafer handling and processing
-Substrates & insulators for microelectronic devices & opto electronic devices
-Substrates for electronic packages
-Chip carriers for sensors and detectors
-Laser heat management components
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