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Specifications | ||
PCB board adjustable width | Max.50~250mm | |
PCB board transport height | 750±50mm | |
PCB board transportation speed | 0~1800mm/Min | |
PCB board transportation angle (welding inclination) | 3~7° | |
PCB board transportation direction | L→R or R→L | |
PCB board height limitation | Max.100mm | |
Peak height range | 0 — — 12mm adjustable, and keep the peak balance | |
Number of peaks | 2 | |
Preheating zone length | 700mm | |
Number of preheating zones | 2 | |
Way to heat up | Hot air | |
Preheating zone temperature | Room temperature ~ 250 ℃ can be set | |
Applicable solder type | Lead-free solder / ordinary solder | |
Tin furnace power | 6kw | |
The amount of tin dissolved in the tin furnace | Approx.120kg | |
Tin furnace temperature | Room temperature ~ 300 ℃, control accuracy ± 1-2 ℃ | |
Temperature control method | P.I.D+SSR | |
Machine control mode | Mitsubishi PLC + display control touch screen | |
Flux capacity | Max5.2L | |
Flux flow | 10~100ml/min | |
Spray method | Stepping motor | |
Power supply | 3-phase 5-wire system 380V | |
Starting power (total power) | Max.11kw | |
Normal operating power | Approx.1.5kw | |
Gas source | 4~7KG/CM2 | |
Frame size | L1450×W1050×H1450mm | |
Dimensions | L2200×W1100×H1550mm | |
Weight | Approx.400kg | |


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