Customized Fr4 94v 0 Wireless Earphones PCB Printed Circuit Board Mass Production

Specifications

Standard Technology

Advanced Technology

Number of Layers

1 - 12

14 - 40

Board Material

FR-4 (Tg-135C, 145C, 170C), Halogen- free

Rogers Ultralam 2000, Rogers RO4350, Rogers RO4003

Polyimide

Black FR-4

Arlon AR-350

Getek Copper Clad Thermal Substrates

(Rogers and FR4) BT Epoxy

Nelco 4013

PTFE

Metal Core Materials

Aluminum Core

Minimum Board Thickness

2 layer - 0.010"

4 layer - 0.020"

6 layer - 0.020"

8 layer - 0.062"

10 layer - 0.062"

12 layer - 0.062"

2 layer - 0.005"

4 layer - 0.010"

6 layer - 0.031"

8 layer - 0.040"

Maximum Board Thickness

2 layer - 0.125"

3-12 layer - 0.200"

0.250" - 0.500"

Copper Thickness

0.5 oz - 3 oz

4 oz - 6 oz

Hole Aspect Ratio

7 : 1

15 : 1

Minimum Hole Size

0.008"

0.006"

Minimum Trace/Space

0.006"/0.006"

0.003"/0.003"

Minimum

Drill-to-Copper

0.010"

0.003"

Minimum Pitch

1 mm

0.3 mm

Surface Finish

HASL (Solder)

Lead Free Solder

Copper

Gold

Gold Fingers

White Tin

OSP

HASL

Gold (ENIG/Hard/Soft)

ENEPIG

Selective Gold

Immersion Silver

OSP

White Tin

Solder Mask

Green/Black/Red/Blue/Yellow/White/Clear

Orange/Mix-and-match

Silk Screen

White/Black/Yellow

Green/Red/Blue

Quality Standards

IPC 6012 Class 2

Electrical Testing

100% Netlist Testing

TDR Testing

ISO9001

TS16949

Item

Description

Layer

Flex board: 1-6Layers
Flex-Rigid Board: 2-8Layers

Material

PI, PET, PEN, FR-4

Final Thickness

Flex board: 0.002" - 0.1" (0.05-2.5mm)
Flex-rigid board: 0.0024" - 0.16" (0.06-4.0mm)

Surface Treatment

Lead-free: ENG Gold; OSP, Immersion silver, Immersion Tin

Max / Min Board Size

Min: 0.2"x0.3"  Max: 20.5"x13"

Min Trace
Width / Min Clearance

Inner: 0.5oz: 4/4mil  Outer: 1/3oz-0.5oz: 4/4mil
1oz: 5/5mil               1oz: 5/5mil
2oz: 5/7mil               2oz: 5/7mil

Min Hole Ring

Inner: 0.5oz: 4mil     Outer: 1/3oz-0.5oz: 4mil
1oz: 5mil                  1oz: 5mil
2oz: 7mil                  2oz: 7mil

Copper Thickness

1/3oz - 2oz

Max / Min Insulation Thickness

2mil/0.5mil (50um/12.7um)

Min Hole Size and Tolerance

Min hole: 8mil
Tolerance: PTH±3mil, NPTH±2mil

Min Slot

24mil x 35mil (0.6x0.9mm)

Silkscreen Line Width

5mil

Gold Plating

Nickel: 100u" - 200u"

Gold: 1u"-4u"

Immersion Nickel / Gold

Nickel: 100u" - 200u"

Gold: 1u"-5u"

Immersion Silver

Silver: 6u" - 12u"

OSP

Film: 8u" - 20u"

Test Voltage

Testing Fixture: 50-300V

Profile Tolerance of Punch

Accurate mould: ±2mil

Ordinary mould: ±4mil

Knife mould: ±8mil

Hand-Cut: ±15mil

To ensure an accurate quote, be sure to include the following information for your project:

• Complete GERBER files including the Excellon Drill File


• Other file types (PCB123, Altium, Eagle,Protel, IVEX, Ultiboard (up to V12) and OrCAD (with .MAX file extension)  also accepted as well as hand layups / films etc


• "Read Me" notes for additional fabrication information


• Quantities


• Turn time


• Panelization Requirements


• Materials Requirements


• Finish requirements

Your custom quote will be delivered in just 2-24 hours, depending on the design complexity.