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M triangle PG Ones Fiber Laser Back Cover Glass Remove LCD Separating Machine Laser Engraving Marking Machine
M-triangle PG Ones Fiber Laser Back Cover Glass Remove LCD Separating Machine Laser Engraving Marking Machine
M-triangle PG Ones Fiber Laser Back Cover Glass Remove LCD Separating Machine Laser Engraving Marking Machine
M-triangle PG Ones Fiber Laser Back Cover Glass Remove LCD Separating Machine Laser Engraving Marking Machine
M-triangle PG Ones Fiber Laser Back Cover Glass Remove LCD Separating Machine Laser Engraving Marking Machine
M-triangle PG Ones Fiber Laser Back Cover Glass Remove LCD Separating Machine Laser Engraving Marking Machine

M triangle PG Ones Fiber Laser Back Cover Glass Remove LCD Separating Machine Laser Engraving Marking Machine

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Price:$1,500.00 - $1,550.00

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Product Overview

Description



Product specifications


Model
PG Ones
Voltage
110V / 220V
Laser power
20W
Machine power
≤ 800W
Marking speed
≤10000mm/s
Marking power
≤0.001MM
Cooling method
built-in air cooling
Laser wavelength
1.06μm
Laser equipment size
300 mm*453 mm*588.5 mm
Power supply
220V ± 10%, 50HZ ± 5%
Ambient temperature
-10 ° C ~ 65 ° C
Repeatability
≤0.001mm
Marking depth
0.015-0.5mm
Marking range
175*175mm
Marking line width
0.05-0.01mm
Equipment weight
21.2kg
Packing Size
680*680*360mm
Gross weight
32kg


Product performance description
1. Unique styling design
2. Default laser power 8W, optional 20W
3. Insufficiently intelligent and flexible closed system
4. Builtin computer and comes with software, easy for operating
5. Recommended removing middle frame and rear glass separation/disassembly/Marking/Engraving
6. Suitable for all touch screen smartphones Laser Repair in the market, such as iPhone, Huawei, Xiaomi, OPPO, Vivo, LG
7. Applicable Many types of metals materials: Gold, Silver, Stainless Steel, Copper, Aluminum, chrome Brass, etc Metal
8. Engraving, Mobile Phone LCD Separate, Mobile Phone Middle Frame Cutting, Mobile Phone Back Cover Glass Separator, Alloy, and
metal oxides: Anodized Aluminum, Some nonmetal materials & Special surface treatment: silicon wafer, ceramics, plastic.


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