aluminum wire bonder/ digital tube welding machine/IC semiconductor packaging equipment
- Category: >>>
- Supplier: Guangzhou Minder-Hightech Co. Ltd.
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Product Overview
Description
Product Description
High-speed wire bonding machine
Ultra-quiet workbench, creating an excellent working environment
Fully enclosed workbench extends the service life of mechanical parts
Mass separation XY table suitable for light load and high speed occasions
The position is more precise, meeting the demanding requirements of 0.18μm process wafers
Fully enclosed workbench extends the service life of mechanical parts
Mass separation XY table suitable for light load and high speed occasions
The position is more precise, meeting the demanding requirements of 0.18μm process wafers
CT3100
Speed: 5 wires/second
1. updated from CT3100, XP operation system, digital camera import from German, 15% faster than CT3100.
2. Suit for small board bonding (quartz, watch, light, toys, LCM, etc. )
1. updated from CT3100, XP operation system, digital camera import from German, 15% faster than CT3100.
2. Suit for small board bonding (quartz, watch, light, toys, LCM, etc. )
CT3000
Speed: 6 wires/second
Suit for high precession, super multi-wires products single IC (as card reader, U disk, digital camera, telephone etc.).
Suit for high precession, super multi-wires products single IC (as card reader, U disk, digital camera, telephone etc.).
CT2300
Speed: 6 wires/second
Suit for high precession, super multi-wires products single IC (as card reader, U disk, digital camera, telephone etc.).
Suit for high precession, super multi-wires products single IC (as card reader, U disk, digital camera, telephone etc.).
Shuttle 800B wire bonding machine
Fully enclosed copper wire gas protection device, anti-oxidation, low gas consumption;
The chip and the pins are reserved at the same time, which can handle the support with uneven pin distribution;
The high-resolution 1μm XY table ensures the accuracy of the equipment;
Friendly human-computer interaction, classified design parameter menu, simple and easy to learn.
The chip and the pins are reserved at the same time, which can handle the support with uneven pin distribution;
The high-resolution 1μm XY table ensures the accuracy of the equipment;
Friendly human-computer interaction, classified design parameter menu, simple and easy to learn.
Specifications
model | CT2300 | CT3000 | CT3100A | ||
Z stroke | 0.4” | ||||
Resolution | 1μm | ||||
Wire feeding degree | 30° | 30° (45° optional) | |||
Wire diameter | 1.0-2.0 MIL | 0.8-2.0 MIL | 1.0-2.0 MIL | ||
Bonding force | 15-80 gm | ||||
Bonding power | 0-2W adjustable | ||||
Bonding time | adjustable | ||||
Distance between | 4.8 mm | ||||
Bonding head and base | Work stage | ||||
XY stroke | 2"*2" | 2"*2" | 3"*3" | ||
Rotary range | No limit | ||||
Base dimension | Max rotary R: 380mm | ||||
transducer | Light weight aluminum alloy | ||||
Process scan range XY | ±1mm (Magnification 3.5 times) | ||||
Process scan range rotary | ±15° | ||||
Optical system | 2.5X process control | ||||
Storage | Up to 99 programs, up to 1000 COB chips per program, up to 1000 lines per chip | ||||
Voltage | 2 phase 220V | ||||
Frequency | 50/60 HZ | ||||
Power | 800W | ||||
weight | 240kg | 270kg | 280kg | ||
size | 1050*750*1400mm | 630*700*1350mm | 750*1050*1450mm | ||
Bonding speed | 50ms/wire for 2mm |
Bonding accuracy | ±3.0 μm |
Wire length | Max.8mm |
Wire diameter | 15-50μm |
Wire type | Au, Ag, Alloy, CuPd, Cu |
Bond type | Single line /BSOB/BBOS |
Loop control | Support ultra-low arc |
Bonding area | 56mm*65mm |
XY resolution | 0.1μm |
Transducer system | 138kHZ |
PR accuracy | ±0.37μm，±0.74μm |
Applicable magazine | 120-305*45-98*50-180mm |
Magazine pitch | Min 1.5mm |
Applicable lead frame | 100-300*40-90*0.1-1.3mm |
Different lead frame | ＜5min |
Same lead frame | ＜15min |
Operation interface | ＜4min |
Overall dimension | Chinese/English |
volume | 950mm*920*1850mm |
Weight | 750kg |
Voltage | 190~240V |
Frequency | 50HZ |
Compressed air | 0.6-0.97bar |
Air consumtion | 80L/min |
Sample
Product details
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