1X2 Port Modular Jack RJ12 Side Entry 6P6C Right Angle 5521A RJ25 Connector L=16.5mm
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- Supplier: Dongguan City Coorle Information Technology Co. Ltd.
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Product Overview
Description
RJ45/RJ11 SPECIFICAT
RJ45/RJ11 SERIES JACK PRODUCT SPECIFICATION
| ELECTRICAL | |
| CURRENT RATING: | 1.5 AMPS@25℃ |
| VOLTAGE RATING: | 125 V AC |
| INSULATION RESISTANCE: | 1000 MΩ Min. @ 500V DC WITHSTAND |
| WITHSTAND VOLTAGE: | 1000 V AC RMS,contact to contact or 1500V DC ,contact to screen and test panel @ 0.5mA 50 Hz or 60 Hz a minute |
| CONTACT RESISTANCE: | 1XN ROUND PIN 35 mΩ Max.( ) 1XN FLAT PIN 45 mΩMax.( ) 2XN ROUND PIN 40 mΩ Max.( ) 2XN FLAT PIN 50 mΩ Max.( ) 20 mΩ Max. ( ) |
| LED OPERATION VOLTAGE: | 1.8~2.6V; LED OPERATION CURRENT:20 mA MAX. ( ) |
| MECHANICAL | |
| MATING/UNMATING FORCE: | 22N / 2.27Kg MAX. ( ) 30N MAX. ( ) |
| RETENTION STRENGTH: | 50N MIN. ( ) 30N MIN.( ) ( )for 60s±5s |
| DURABILITY: | 750( )1500( )OPERATION MIN. |
| ENVIRONMENTAL | |
| OPERATION TEMPERATURE: | -40℃~+85℃ ( ) 0℃~+70℃ ( )FOR PC / ABS |
| STORAGE TEMPERATURE: | -40℃~+85℃ ( ) 0℃~+70℃ ( ) FOR PC / ABS RELATIVE HUMIDITY<80% |
| GUARANTEE PERIOD: | 6 MONTHS( )12 MONTHS( ) |
| ASSEMBLY PROCESS: | WAVE SOLDERING:260±5℃ 5~10S( );IR REFLOW:260±5℃ 5~10S( ) |
| MANUAL SOLDERING PARAMETERS: | MANUAL SOLDERING TEMPERATURE AND TIME(℃/S): 400±5℃( ) 360±5℃( ),TIME(S)<5S,MAX. SOLDERING TIMES:3 |
| SALT WATER SPRAY: | GOLD PLATING: G/F~2 u",TEST TIME 8H MIN.( ) GOLD PLATING: PDNI15/20 u",3 u",6 u",TEST TIME 24H MIN.( ) GOLD PLATING: 15 u",30 u",50 u", TEST TIME 48H MIN.( ) |
| SHELL MATERIAL: | COPPER ALLY( )SPCC( )STAINLESS STEEL( )PLATING NICKEL ( ) . 30u" MIN( )50u" MIN( )OVER ALL,TEST TIME 24H MAX. |
| MATERIAL | |
| HOUSING: | PBT( V )PA46( )LCP( )PA66( )ABS( )PC( )PA6T( ) |
| FLAMMABILITY CLASS : | UL94V-0( V ) UL94V-1( ) UL94V-2( ) UL94-HB( ) |
| SHIELD: | BRASS ( ); STAINLESS STEEL( ); THICKNESS 0.20MM; ( )THICKNESS 0.25MM, ( ) PLATED NICKEL ( )30 u"MIN( ). OR 50u"MIN( ). |
| TERMINAL: | ( )DIA. 0.46MM PHOSPHOR BRONZE ,GOLD PLATING AT CONTACT AREA, NICKEL 30u" MIN.( )OR 50u" MIN.( ) OVER ALL ( )THICKNESS 0.35MM PHOSPHOR BRONZE ,GOLD PLATING AT CONTACT AREA, MATTE TIN AT TAIL 100 u" MIN., NICKEL 30u" MIN. ( )OR 50u" MIN.( ) OVER ALL |
| GOLD PLATING 1: | Fu(AVERAGE: 0.6u" MIN)inch( )G/F(AVERAGE:<=0.6u.)inch( ) 2 u"(AVERAGE:2.0u" MIN.)inch( ) 1.5 u"(AVERAGE: 1.5u" MIN.)inch( ) 3 u" (AVERAGE: 2.8u" MIN. )inch( ) 6 u" (AVERAGE:5.5u"MIN.)inch( ) 15 u" (AVERAGE: 14.5u" MIN.)inch( ) 30 u" (AVERAGE: 28.5u"MIN. )inch( ) 50 u" (AVERAGE: 48u" MIN.)inch( ) PDNI20 u" inch( ) Density of Au:17.5g/cm3 |
| GOLD PLATING 2: | G/F(AVERAGE: 0.8u"MIN.)inch( ) 3 u" MIN. inch( ) 6 u" MIN. inch( ) 15 u" MIN. inch( )30 u" MIN. inch( ) 50 u" MIN. inch( )Density of Au:17.5g/cm3 |
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