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Key Parameters Of MCPCB | ||||||
ITEM | Standard | Advanced | ||||
Layer Count | Max Layer Count | 4L | 8L | |||
Board Thickness | Max PCB Thickness | 5.0mm | 5.0mm | |||
Min PCB Thickness | 0.5mm | 0.5mm | ||||
Finished Size(AL,Copper,Sintered Board) | Min Finished Size | 5*5mm | 5*5mm | |||
Max Finished Size | 610*610mm | 10*1012mm | ||||
Max Finished Size(Ceramic Board) | 100*100mm | 100*100mm | ||||
Max Base Copper Weight | 8OZ | 10OZ | ||||
Min finished hole size and tolerance | NPTH:0.5±0.05mm;PTH(AL、Copper):1.0±0.1mm;PTH(Metal core printed board):0.2±0.10mm; | |||||
Tolerance of Routing | ax PCB Aspect Ratio | ±0.1mm | ±0.05mm | |||
Coefficient of thermal conductivity | 0.3-3w /m.k (AL, Copper); 8.33w /m.k (Sintered Board); 0.35-30W/ M.K (Buried Metal Board); 24-180w /m.k (Ceramic Board) | |||||
Surface Treatment | HASL/LF-HAL;OSP;ENIG;Electronic Gold Plating;Hard Gold Plating;Anodic oxidation、Hard oxidation | |||||
Material | Metal Substrate | Shengyi SAR20, Yugu YGA,T110/1/2,T112B/C,VT-4A1/2/3/5,1KA04/6/8 | ||||
Ceramic | Al2O3 /AlN (inch):4.5*4.5//5.0*5.0//5.5*7.5 | |||||
MCPCB LEAD TIME | ||||
Layer | Quick Turn/Normal Time | Mass Production | ||
1L | 3 days/5 days | 8-10 days | ||
2L | 4 days/7 days | 10-12 days | ||
4L | 7 days/10 days | 12-14 days | ||
6L | 8 days/12 days | 16-18 days | ||
8L | 9 days/14 days | 16-18 days | ||














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