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201B BGA Balls Reballing Kit Tin Planting Platform for PUM SMC T1 T2 RAM NAND WIFI Power Chips
-201B BGA Balls Reballing Kit Tin Planting Platform for PUM SMC T1 T2 RAM NAND WIFI Power Chips
-201B BGA Balls Reballing Kit Tin Planting Platform for PUM SMC T1 T2 RAM NAND WIFI Power Chips
-201B BGA Balls Reballing Kit Tin Planting Platform for PUM SMC T1 T2 RAM NAND WIFI Power Chips
-201B BGA Balls Reballing Kit Tin Planting Platform for PUM SMC T1 T2 RAM NAND WIFI Power Chips
-201B BGA Balls Reballing Kit Tin Planting Platform for PUM SMC T1 T2 RAM NAND WIFI Power Chips
-201B BGA Balls Reballing Kit Tin Planting Platform for PUM SMC T1 T2 RAM NAND WIFI Power Chips

201B BGA Balls Reballing Kit Tin Planting Platform for PUM SMC T1 T2 RAM NAND WIFI Power Chips

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Description








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Product Name

DS-201B BGA Balls Reballing Kit Tin Planting Platform for Macbook PUM SMC , T1, T2 RAM NAND WIFI Power Chips


Model number

DS-201B


Base size

80*80*5mm


Magnetic base size

80*80*8.2mm









DS-201B is a MacBook tin planting platform, mainly used for tin planting of small BGA chips (including PMU, SMC, T1, T2, RAM, NAND, WIFI, Power Chip).

2. DS-201B (contains 16 steel meshes, 15 steel mesh fixing seats, 2 magnet bases, 9 tin-planting steel plates, and 1 ceramic tin-planting knife)



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2 ND GEN-T2: 2nd generation T2 chip steel mesh



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MacBook BGA Chips steel sheet



MacBook Pro A1706/1707 BGA Chips



MAC WIFI Chips steel sheet



MAC SDD Master Chips steel sheet



MacBook Pro A2159 BGA Chips



T2/PMU/SMC/SSD Control Chips










 



























































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