ID Slicer for wafer/crystal/glass/ceramic/semiconductor

Designed for automatically slicing semiconductor material, glass, ceramic, lithium tantalite and lithium columbate and other hard or fragile materials.

Main Features:

Spindle unit:

It adopts vertical spindle design. It uses radial ball bearing to increase the rigidity, precision and life. Its vibration is small.

Worktable unit:

Worktable use high precision linear guideway an AC servo system. The range of speed is wide and the low speed performance is better. It can satisfy requirements of different materials.

Feeding unit:

Feeding system uses step motor and driving system to improve stability and precision.

Specification:

QP-301D
1,Maxima Diameter of Cutting Ingot:  < ¢100mm
2,Blade Standard:   ¢422mm× ¢152mm×0.15mm 
3,Maximal Length of Cutting Ingot: 350mm
4,Cutting feeding speed: 1~99mm/min
5,Cutting Return Speed:1~999mm/min 
6,Stepping deviation of feeding system: ±0.007mm(testing with l mm feeding step)
7,Range of Wafer Thickness: 0.001~40.00mm
8,Adjustment of Crystal Direction:
a,Horizontal range(x)±7°(resolution:2')
b,,Vertical range(Y)±7º  (resolution:2')
9,Power:2.5kw  ~380v±38v  50HZ±1HZ
10,Source of Air:0.4~0.5MPa
11,Touching Panel:5.7inch
12,Dimension: 1100mm×660mm×2230mm
13,Weight:1100kg
14,Optional Solution:
D422mDeep blade plate for Range of wafer thickness maximal ¢58.000mm
D457mm blade plate for range of ingot diameter maxmal ¢105mm

QP-613B
1,Maximal Diameter of Cutting Ingot: D153mm
2,Blade Standard: ¢690mm× ¢241mm×0.15mm or ¢690mm× ¢235mm×0.15mm
3,Maximal Length of Cutting Ingot:400mm
4,Cutting speed:0.2~99mm/min
5,Return Speed:1~1000mm/min
6,The speed of main spindle:1420r/min
7,Stepping deviation of feeding :±0.005mm(testing with l mm feeding step)
8,Range of Wafer Thickness:0.001~68.00mm
9,Adjustment only of Crystal Direction:0.001mm  
10,Adjustment of Crystal Direction:
a,Horizontal range(x)±7°(resolution:2')
b,Vertical range(Y)±7º(resolution:2')
11,Power:3.5kw,~380v±38v, 50HZ±1HZ
12,Source of Air:0.4~0.5MPa,250L/min(instantaneous flux when braking)
13,Sour of cooling water:0.2~0.4mpa;5L/min
14,Touching Panel: 7.7inch
15,Dimension:645mm×925mm×2820mm
16,Weight:2500kg

Click here of below photo to view all the Inner Diameter Slicer to choose a suitable one.