Embedded System Android9.0 Linux i.MX8M mini CPU motherboard mainboard for industry data transfer devices

Hardware 

Resources

CPU

NXP i.MX8M Mini processor,Quad ARM® Cortex™-A53+Cortex-M4, 1.8 GHz of i.MX8M, 400MHz of Cortex®-M4

RAM

1GB LPDDR4 ( up to 2GB LPDDR4)

Flash

8GB EMMC, ( up to 16GB EMMC,32GB EMMC)

Network

1-ch AR8035 Internet chip adopts RGMII supporting adaptability l10M/100M/1000M

1-ch LAN 7430 port chip, supporting 10M/ 100M/1000M

Onboard WIFI (AP6236)

Communication

4-ch RS232, 2 port as the debug UART

4-ch USB 2.0, 1-ch USB-OTG

2-ch CAN 2.0

Display

4-ch MIPI each Display channel’ s resolution up to 1920 * 1200

Audio

McASP audio interface; binaural output; MIC audio input

Input

Standrad I2C Capacitive panel

1-ch CSI camera interface (4-ch)

Expansion

Interface

MINI-PCIE interface with SIM socket for 4g module

Memory Interface

1-ch SD card

Expansion

Interface

GPIO interface

Other

Reset circuit, Watch dog, RTC, Buzzer, JTAG interface

Power Input

+12V power supply

Resource

Development

Tools

Development environment: Virtual Machine VM9.0.2+ubuntu12.04.1 or Ubuntu 14.04

Application layer development debug tool

Cross-compiler

Common terminal development debugging tool

Image File

ISO of matched operating system

Test Program

Interface using demo test program and test program source code

Source Code

Bootloader, kernel, system source code

Manual

Mainboard User manual,Hardware Manual, Device Manual

Mechanical Chart

Back Plane’s Structure & Size

Electrical Specification

Size

Core Board:55mm*60mm, 8-layer high precision immersion gold process

Back Board: 200mm*130mm,4-layer high precision immersion gold process

Power

Consumption

≤5W

Operation

Temperature

-40℃ ~ +85℃ ( industrial level ),0℃ ~ +85℃ (Consume Level, According to customers’ requirements)

Operation

Humidity

5% ~ 95%, Non-Condensing