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| ITEMS | Parameter | Remarks | ||
| Double side & Multi-layer | ||||
| Number of Layers | 1-20 layers | |||
| Board Materials | FR4,CME3,CME1,5G | |||
| PCB Size (Min- Max) | 50x80mm to 1000mm×600mm ( 39.37"x23.6") | |||
| innerlayer line width/space(min) | 4mil/4mil(100um/100um) | |||
| Finish Plating /Surface Finishes | HASL ,OSP,ENIG,HASL,gold finger,Au Panel,OSP,ENIG, | |||
| innerlayer pad (min) | 5mil(0.13mm) | Pad annular | ||
| Core thickness (min) | 8mli(0.2mm) | |||
| Finisher Copper Inner Layers | 1/2oz(17um)a- | No Cu Clad | ||
| Finished Copper Outer Layers | 1/2oz(17um) | |||
| Final PCB Thickness (tolerance %) | 0.5-4.0mm | |||
| Final PCB Thickness (tolerance %) | Thickness<1.0mm | ±12% | 4-8layers | |
| 1.0mm≤Thickness<2.0mm | ±8% | 4-8layers | ||
| ±10% | ≥10layers | |||
| Thickness≥2.0mm | ±10% | |||
| inner layer process | Brown Oxide | |||
| Minimum Conductor Space | ±3mil(±76um) | |||
| Minimum Drill Hole Size | 0.25mm | |||
| min diameter of finished hole | 0.2mm | |||
| Hole position accuracy | ±2mil(±50um) | |||
| Drilled slot tolerance | ±3mil(±75um) | |||
| PTH tolerance | ±2mil(±50um) | |||
| NPTH tolerance | ±1mil(±25um) | |||
| maxA.R.Of PTH | 8:1 | |||
| PTH hole copper thickness | 0.4-2mil(10-50um) | |||
| image to image tolerance | ±3mil(0.075mm) | |||
| outer layer line width/space(min) | 3mil/3mil(75um/75um) | |||
| Solder Mask Thickness | line end | 0.4-1.2mil(10-30um) | ||
| line Corner | ≥0.2mil(5um) | |||
| on Substrate | ≤Finished Cu thickness+1.2mm≤Finished Cu thickness+30um)≤+1.2mil≤+30um) | |||
| min solder mask dam | 4.0mil(100um) | |||
| impedance control and tolerance | 50Ω±10% | |||
| warp and twist | ≤0.5% | |||
| Delivery time | 1-2 layers 10-12days | |||
| 4-20 layers 12-20days | ||||
| Package | General export packaging | |||











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