Automatic motherboard repair machine with Infrared heating BGA rework station price with PLC

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Product Overview

Description



Products Description




Feature
1. The integrated design of hot air head and placement head has the functions of automatic placement, automatic welding andautomatic disassembly;
2. Independent three temperature zones (upper temperature zone, lower temperature zone, infrared preheating zone), the upper temperature zone and the lower temperature zone realize synchronous automatic movement, and can automatically reach any position in the bottom infrared preheating zone. The lower temperature zone can move up and down, support the PCB, and adopt automatic motor control. Realize that the PCB does not move on the fixture, and the upper and lower heating heads can be moved to the target chip of the PCB;
3. PCB card board adopts high-precision slider to ensure the placement accuracy of BGA and PCB board;
4. The original bottom preheating platform adopts excellent heating materials imported from Germany (infrared gold-plated light tube)+ anti-glare constant temperature glass (temperature resistance up to 1800 ℃). The preheating area reaches 500 * 420mm; The preheating platform, clamping plate device and cooling system can move in the X direction as a whole. Make PCB positioning and folding welding safer and more convenient;
5. X, Y adopts the motor automatic control movement mode, which makes the positioning fast and convenient, the equipment space is fully utilized, and the ultra-large area PCB is repaired with a relatively small equipment volume, the maximum splint size can reach 510 * 480mm, and there is no corner for repair.
6. Double rocker control, alignment lens and upper and lower heating platform to ensure alignment accuracy;
7. Built-in vacuum pump, φ angle rotation, precise fine adjustment of mounting nozzle;
8. The suction nozzle automatically recognizes the suction material and the mounting height, and the pressure can be controlled within a tiny range of 10 grams. It has 0 pressure suction and mounting functions for small chips;
9. The color optical vision system has manual X, Y direction movement, with split-color, magnification and fine-tuning functions,including color difference resolution device, auto focus, software operation function, and can be repaired with a maximum BGA size of 80 * 80 mm;
10. Various sizes of alloy hot air nozzles are easy to replace and can be rotated and positioned 360 °;
11. Configure 5 temperature measurement ports, with multi-point real-time temperature monitoring and analysis function;





Specifications


Model
RS800
Dimensions
L970 * W700 * H830mm
Total power
7600W
Upper heating power
1200W
Lower heating power
1200W
Infrared heating power
5000W (2000W controlled)
Power supply
Two-phase 220V, 50 / 60Hz
Targeting
Optical lens + V-shaped card slot + laser positioning lamp for quick positioning
Selection of electrical appliances
touch screen + temperature control module + PLC + stepper driver
Maximum PCB size
630 * 480mm (actual effective area, no rework corner)
Minimum PCB size
10*10mm
Number of temperature measuring interfaces
5
Chip zoom in and out
2-50 times
PCB thickness
0.5~8mm
Applicable chip
0.8*0.8~80*80mm
Applicable chip minimum pitch
0.15mm
Mounting maximum load
800g
Mounting accuracy
±0.01mm
Weight
Approx.135KG




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Company Profile




              Max Innovate Technology(Shenzhen) Ltd is the leading PCB factory solution provider inChina,offering professional machine and assembly line accessories as the DIP welding equipment series, SMT welding equipment series and SMT&DIP whole line series over 20 years.We sincerely hope to work together with every client, to build the long-term business and friendship. 


Ours products are exported to more than 40 countries and regions in the world




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