The product is a non-cleaning solder paste using a high reliability flux, which is a scientific complex of film forming agent, modified resin, organic active agent and polymer alcohol-ether solvent. Mixed with high sphericity, uniformly distributed, low oxygen content Sn60/Pb40 alloy powder particles, with excellent rheological properties, good printing and mold resistance to collapse, moderate flux activity, good solderability performance, ideally for lead soldering process.
Product Name
JF-333A Sn60Pb40 solder paste
Application
Lead soldering
Alloys
Sn60Pb40
Powder particle size
T3 , 25-45um
Max. Temperature
220-230℃
Recommend temperature profile
Packing & Delivery
FAQ
Q1: Can you provide COA for each batch?
A1: Sure, we can provide
Q2: Since the solder paste need to be stored in low temperature(0--10° C), what is your measures to minimize exposure to normal temperature .
A2: We maintain all stocks in fridge. Each package filled with Ice bricks during delivery. Also we suggest customer to adopt express shipment to minimize exposure time to ambient temperature.