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Type: | PCB & PCBA |
Model Number: | Programming Board |
PCB Portfolio: | 1-20 layers, Standard, HDI, High-TG, RF PCBs |
Service: | Prototype service, Material sourcing, PCB assembly, Conformal coating, Function test, Box build |
Application: | Industrial, Automobile, Aviation, Medical, Electronics |
PCB Portfolio: | 1-20 layers, Standard, HDI, High-TG, RF PCBs |
Base Material: | FR4, Modified Epoxy, Polyimide, PTFE, Glass, AL, FPC |
Copper Thickness: | 0.5 OZ, 1 OZ, 1.5 OZ, 2 OZ, 3 OZ |
Board Thickness: | 0.2-5.0 MM |
Surface Finishing: | OSP, HAL leadfree, ENIG, Immersion Tin etc. |
Solder Mask Color: | Blue, Green, Red, Black, White.etc |
Min. Width/Space: | 0.075 MM |
Min. SM Bridge: | 0.1 MM |
Min. Hole Dia: | 0.1 MM |
Min. Component Size: | 01005 |
Solder Printer Accuracy: | ±25um |
Multi-function Mounter Accuracy: | ±30um |
Impedance Control Tolerance: | ±5% |
Max. Stencial Size: | 740 x 740 MM |
IC Package: | DIP, SOP, SOJ, PLCC, QFP, QFN, BGA, POP etc |
PCB Capacity: | 55000 Square Meter/Month |
SMT Capacity: | 14 Million Chips/Day |
DIP Capacity: | 1.2 Million DIP Holes /Day |
Packaging Details: | Vacuum packing, Anti-static package (or in your requirement) |
Port: | Shenzhen, Hongkong |

Characteristic | Material | Board thickness | Specification | Surface Treatment | ||
8L BGA + Gold Finger Board | FR4 | 2.0mm | Plugged vias | Min. solder dam | ENIG, Gold plated Finger | |
FR4 | 2.0mm | 0.25mm | 0.1mm | |||
10-layer Impedance Board | FR4 | 1.6mm | BGA with Plugged vias | Impedance Control | ENIG | |
FR4 | 1.6mm | 0.25mm | 50Ω ±8% | |||
12-layer HDI Board | FR4 Tg180 | 2.0mm | Blind holes | Min. Hole | ENIG | |
FR4 Tg180 | 2.0mm | L1-L3, L1-L4, L7-L12, L9-L12 | 0.2mm | |||
14-layer Heavy Copper Board | FR4 High Tg170 | 3.5mm | Copper | Min. Hole | ENIG | |
FR4 High Tg170 | 3.5mm | All layers 3OZ | 0.5mm | |||








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