170 Models 8500pcs RC1206 SMD FR 07 Series Resistor 1% Accuracy Sample Book Assortment Kit

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Product Overview

Description



Product Description








Technical Support




BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES.

Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125℃±5℃ x 24 hours or 80℃±5℃ x 48 hours

Pay attention to the difference between
leaded (Pb) balls and lead free (No Pb) balls.


Lead-free/No Pb BGA chips: 245℃-260℃(Maximun)

Leaded/Pb BGA chips:180℃-205℃(Maximun)



Packing & Delivery


Original & Well Package.



DHL/UPS/FedEx - 3~7 days
Aramex - 5~15 days
China Post/SG Post/HK Post - 15~60 days





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Contact Info


Mandie

Email : sales7(at)hklrf.com
Skype : lrfsales10



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