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Name | Lead free solder wire |
Weight | 500g |
Melt point | 218° |
Flux content | 2.2% |
Component content | Sn:99.3% Cu:0.7% |
Wire diameter | 0.5mm/0.6mm/0.8mm/1.0mm/1.2mm/1.5mm |
Name | Lead free solder wire |
Weight | 100g |
Melt point | 218° |
Flux content | 2.2% |
Component content | Sn:99.3% Cu:0.7% |
Wire diameter | 0.5mm/0.6mm/0.8mm/1.0mm/1.2mm/1.5mm |
Name | Lead free solder wire |
Weight | 50g |
Melt point | 218° |
Flux content | 2.2% |
Component content | Sn:99.3% Cu:0.7% |
Wire diameter | 0.5mm/0.6mm/0.8mm/1.0mm/1.2mm/1.5mm |
Igredient | Sn | Cu | Fe | Pb | Ag | Ni | Zn | ||||
Content(%) | 99.3±1.0 | 0.7±0.2 | 0.02 | 0.10 | 0.10 | --- | 0.001 | ||||
Igredient | Bi | Cd | In | Au | Al | As | Sb | ||||
Content(%) | 0.10 | 0.002 | 0.10 | 0.05 | 0.001 | 0.03 | 0.10 | ||||
Melting point (℃) | 227 | specific gravity (g/cm3) | 7.4 |
Performance | |||
Halogen-containing | Halogen-free | ||
Acid value (KOHmg/g) | ≤150 | -- | |
Halogen cntent (%) | ≤0.3 | -- | |
Copper mirror corrosion test | Can not pierce or fall off | ||
Flux content (%) | 1.5-2.5 (Can be customized according to customer requirements) | ||
Expansion rate (%) | ≥80 | ||
Dryness | Dry, easy to remove residue | ||
Surface insulation resistance after welding (Ω) | The comb-shaped electrode spacing is 0.03mm≥1.0×1011 | ||
Electromigration (Ω) | ≥1.0×1011 10x magnification identified with comb-shaped electrode, the crystal growth less than 20% of the wire spacing, the wire no corrosion. | ||
Ion contamination (μ/cm2) | ≤3.0 |
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