BTM356 Bluetooth Module Qualcomm QCC3056 Optical TWS I2S IIS SPDIF Bluetooth Audio Module
- Category: >>>
- Supplier: Shanghai Belite Technology Co. Ltd.
Share on (1600518252950):
Product Overview
Description
PRODUCT INFORMATION
Brand: | Belite |
Model: | Bluetooth 5.0audio module |
supports: | both aptxhd and ldac formats! |
Audio input method: | Bluetooth 5.0 audio output |
OEM&ODM: | yes |
supports: | aptx-hd I2S SPDIF DAC etc. |
BTM324 Bluetooth module Qualcomm QCC3024 optical fiber I2S Bluetooth 5.0 digital audio module uses Qualcomm QCC3024 chip, built-in 32M FLASH.
BTM324 Bluetooth module introduces the pioneer of the Bluetooth 5.3 modules SJR-BTM356 which is a high performance, cost effective, low power and compact solution. The Bluetooth module provides a complete 2.4GHz Bluetooth system based on the QCC3056 WLCSP chipset which is a single chip radio and baseband IC for Bluetooth 2.4GHz systems. This module is fully qualified single-chip dual mode Bluetooth@v5.3 system.
BTM356(QCC3056) Features
BTM324 Bluetooth module introduces the pioneer of the Bluetooth 5.3 modules SJR-BTM356 which is a high performance, cost effective, low power and compact solution. The Bluetooth module provides a complete 2.4GHz Bluetooth system based on the QCC3056 WLCSP chipset which is a single chip radio and baseband IC for Bluetooth 2.4GHz systems. This module is fully qualified single-chip dual mode Bluetooth@v5.3 system.
BTM356(QCC3056) Features
Qualified to Bluetooth v5.3 specification
Dual 120 MHz Qualcomm® Kalimba™ audio DSPs
32/80 MHz Developer Processor for applications
Firmware Processor for system
Flexible QSPI flash programmable platform
High-performance 24bit audio interface
Digital and analog microphone interfaces
Flexible PIO controller and LED pins with PWM support
Serial interfaces: UART, Bit Serializer (I²C/SPI), USB 2.0
Advanced audio algorithms
Active Noise Cancellation: Hybrid, Feedforward, and Feedback modes, using Digital or Analog Mics, enabled using license keys available from Qualcomm®
Qualcomm® aptX™ and aptX HD Audio
1 or 2 mic Qualcomm® cVc™ headset speech processing
Integrated PMU: Dual SMPS for system/digital circuits, Integrated Li-ion battery charger
Application subsystem
Dual-core application subsystem 32/80 MHz operation
32-bit Firmware Processor (reserved for system use) executes:
Bluetooth upper stack
Profiles
House-keeping code
32-bit Developer Processor executes:Developer applications
32-bit Developer Processor executes:Developer applications
Both cores execute code from external flash memory using QSPI clocked at 32 MHz or 80 MHz
On-chip caches per core enable optimized performance and power consumption
Bluetooth subsystem
Qualified to Bluetooth v5.3 specification including 2 Mbps Bluetooth Low Energy and Bluetooth Low Energy Isochronous Channels
Qualcomm® Bluetooth High Speed Link
Single ended antenna connection with on-chip balun and Tx/Rx switch
Bluetooth, Bluetooth Low Energy, and mixed topologies supported
Class 1 support
Product Description： Bluetooth 5.3 Class1.5 Module
Bluetooth Standard： Bluetooth 5.3
Chipset： QCC3056 WLCSP
Dimension： 13mm x 18mm x2.8mm
Operating Conditions Voltage： 2.8~4.3V
Temperature： -40～+85℃
Storage Temperature： -40～+85℃
Electrical Specifications
Frequency Range： 2402～2480MHz
Maximum RF Transmit Power 9dBm
π/4 DQPSK Receive Sensitivit：y -93dBm 8DPSK
Receive Sensitivity： -87dBm
PRODUCT SHOW
APPLICATION AREA
Consumer Electronics
Wearable Devices
Industrial Manufacture
RELATED MARKETING
COMPANY INTRODUCTION
We Recommend
New Arrivals
New products from manufacturers at wholesale prices
