Kester951 Soldering Pen No Clean Rosin Pen PCB Soldering Flux Pen Flux Repair Tool (1600523212279)

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company & information


 

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Product & Description

 




O1CN01It_pic.jpgTechnical Support





BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING





BGA Chips is MOISTURE SENSITIVE DEVICES.


Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125℃±5℃ x 24 hours or 80℃±5℃ x 48 hours








Pay attention to the difference between
leaded (Pb) balls and lead free (No Pb) balls.


 


Lead-free/No Pb BGA chips: 245℃-260℃(Maximun)


Leaded/Pb BGA chips:180℃-205℃(Maximun)














Packaging & shipping


 

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Packing & Delivery


 Original & Well Package.






DHL/UPS/FedEx - 3~7 days 
Aramex - 5~15 days 
China Post/SG Post/HK Post - 15~60 days










Contact


 







name:Zhu miss
Email : 270724589 @qq.com
WeChat: 13169917459
skype : shenhelen















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